Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Features:

Display: 1999 counts with backlight

hFE: 1 ~ 1000

Diode/continuity test

Data hold

Fuse Protection

Overrange indication

Polartiy indication

Specifications:

DC voltage: 200mV/2V/20V/200V 0.5%+3

600V 0.8%+5

AC voltage: 200V /600V 1.2%+10

DC current: 200A/2mA /20mA 1.0%+3

200mA 1.5%+5,

10A 3.0%+10

Resistance: 200O 0.8%+5

2kO/20kO/200kO 0.8%+2

2MO 1.0%+5

General characteristics:

Power: 6F22 (9V) * 1 ( included)

Product Size: 138mm * 69mm * 31mm

Product Weight: Approx. 170g

Product color: Green & black

Package Size: 16 * 11 * 5cm / 6.4 * 4.3 * 2in

Package Weight: 301g / 10.6oz

Package List:H12474 *1 / MAS830L

1 * MASTECH MAS830L Digital Multimeter

1 * Pair Test Lead

1 * User Manual

SR1EN i3-4030U

Part Number SR1EN i3-4030U Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 1504

Package/Case 440 PCS Description Original new

SR1EN i3-4030U CL8064701552900 Intel Core i3 Mobile CPU BGA1168 1.9 GHz Cores2

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

QK0826A

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Login to Download: * User Manual Buy Probe Accessories

Description

Hantek 6102BE PC USB Digital Storage Oscilloscope 100Mhz 2CH and EXT 250MS/s

Features:

Excellent industrial design-the same anodised aluminium casing as iPad,

which is not only beautiful and tasteful but also greatly enhanced the hardness of aluminum alloy surface,

and has good heat resistance and strong wearability.

Standard USBXI TM interface, easily inserts into USBXI TM housing to make up a combination instrument.

USB2.0 interface, no external power source required, easy to use.

Be suitable for notebook computer, product line maintenance,be used easily on business.

Dimensions (mm):190(L) x100(W) x35(H), be carried easily.

High performance, 250MS/s real-time sampling, 100MHz Bandwidth.

Operating System: Windows 7, Windows NT, Windows 2000, Windows XP,VISTA.

23 measurement functions, PASS/FAIL Check, be suitable for technical application.

Waveform average, persistence, intensity,invert,addition, subtraction, multiplication, division,X-Y plot.

Save waveform in the following: text file, jpg/bmp graphic file, MS excel/word file.

FFT

One computer can connect many DSO, extend channel easily.

LabviewVBVCDelphiC++Builder Second Design instance.

Specifications Table:

Input

Max. sample rate

Real-time sampling:

250MSa/s using one channel(Hantek6102BE)

250MSa/s using one channel(Hantek6212BE)

Channels

2

Bandwidth

100 MHz analog bandwidth(Hantek6102BE)

200 MHz analog bandwidth(Hantek6212BE)

Vertical Resolution

8 bits/channel (Hantek6102BE)

9 bits/channel (Hantek6212BE)

Gain range

Hantek6102BE

10mV ~5V/div @ x1 probe(1,2,5 sequence)

100mV ~ 50V/div @ x10 probe

1V ~ 500V/div @ x100 probe

10V ~ 5KV/div @ x1000 probe

Hantek6212BE

10mV ~10V/div @ x1 probe(1,2,5 sequence)

100mV ~100V/div @ x10 probe

1V ~ 1000V/div @ x100 probe

10V ~ 10KV/div @ x1000 probe

Range

8 divisions

Offset level

+/-4 divisions

Coupling

AC, DC,GND

Offset increments

0.02 div

Impedance

1M ohm

DC accuracy

+/-3%

Input protection

35Vpk (DC + peak AC < 10 kHz, without external attenuation)

Display Mode

Y-T, X-Y and Roll

Timebase

Timebase range

Hantek6102BE

4ns/div-1h/div(1-2-4 sequence)

Hantek6212BE

2ns/div-1h/div(1-2-4 sequence)

Acquisition mode

Hantek6102BE

Real-time sampling: 4ns/div-400ms/div.

Roll mode: 1s/div-1h/div

Hantek6212BE

Equivalent sampling: 2ns/div ~ 4us/div

Real-time sampling: 10us/div ~ 400ms/div

Roll mode: 1s/div ~ 1h/div

Range

10 divisions

Buffer Size

10K ~ 1M

Trigger

Type

Hantek6102BE

Edge trigger

Hantek6212BE

Edge trigger, Pulse Trigger

Mode

Auto, Normal and Single

N13M-GE6-S-A1

Part Number N13M-GE6-S-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 15+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

MCP79MZ-B3

Part Number MCP79MZ-B3 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1020

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

DT71 intelligent Mini Digital tweezers hand-held bridge measurement LCR DVF components signal generator multimeter

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock