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ZME350GBB22GT Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000248
€5.40

ZME350GBB22GT Stencil Template

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OZMICRO OZ8682

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000297
€3.45

OZMICRO OZ8682

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GK106875A1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000251
€6.47

GK106-875-A1 Stencil Template

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GMT G547I2P81U

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000302
€3.45

GMT G547I2P81U

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2160833132 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000265
€5.40

216-0833132 Stencil Template

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OZMICRO OZ813

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000303
€3.45

OZMICRO OZ813

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Hantek 6102BE PC USB Digital Storage Oscilloscope 100Mhz 2CH

Login to Download: * User Manual Buy Probe Accessories

Description

Hantek 6102BE PC USB Digital Storage Oscilloscope 100Mhz 2CH and EXT 250MS/s

Features:

Excellent industrial design-the same anodised aluminium casing as iPad,

which is not only beautiful and tasteful but also greatly enhanced the hardness of aluminum alloy surface,

and has good heat resistance and strong wearability.

Standard USBXI TM interface, easily inserts into USBXI TM housing to make up a combination instrument.

USB2.0 interface, no external power source required, easy to use.

Be suitable for notebook computer, product line maintenance,be used easily on business.

Dimensions (mm):190(L) x100(W) x35(H), be carried easily.

High performance, 250MS/s real-time sampling, 100MHz Bandwidth.

Operating System: Windows 7, Windows NT, Windows 2000, Windows XP,VISTA.

23 measurement functions, PASS/FAIL Check, be suitable for technical application.

Waveform average, persistence, intensity,invert,addition, subtraction, multiplication, division,X-Y plot.

Save waveform in the following: text file, jpg/bmp graphic file, MS excel/word file.

FFT

One computer can connect many DSO, extend channel easily.

LabviewVBVCDelphiC++Builder Second Design instance.

Specifications Table:

Input

Max. sample rate

Real-time sampling:

250MSa/s using one channel(Hantek6102BE)

250MSa/s using one channel(Hantek6212BE)

Channels

2

Bandwidth

100 MHz analog bandwidth(Hantek6102BE)

200 MHz analog bandwidth(Hantek6212BE)

Vertical Resolution

8 bits/channel (Hantek6102BE)

9 bits/channel (Hantek6212BE)

Gain range

Hantek6102BE

10mV ~5V/div @ x1 probe(1,2,5 sequence)

100mV ~ 50V/div @ x10 probe

1V ~ 500V/div @ x100 probe

10V ~ 5KV/div @ x1000 probe

Hantek6212BE

10mV ~10V/div @ x1 probe(1,2,5 sequence)

100mV ~100V/div @ x10 probe

1V ~ 1000V/div @ x100 probe

10V ~ 10KV/div @ x1000 probe

Range

8 divisions

Offset level

+/-4 divisions

Coupling

AC, DC,GND

Offset increments

0.02 div

Impedance

1M ohm

DC accuracy

+/-3%

Input protection

35Vpk (DC + peak AC < 10 kHz, without external attenuation)

Display Mode

Y-T, X-Y and Roll

Timebase

Timebase range

Hantek6102BE

4ns/div-1h/div(1-2-4 sequence)

Hantek6212BE

2ns/div-1h/div(1-2-4 sequence)

Acquisition mode

Hantek6102BE

Real-time sampling: 4ns/div-400ms/div.

Roll mode: 1s/div-1h/div

Hantek6212BE

Equivalent sampling: 2ns/div ~ 4us/div

Real-time sampling: 10us/div ~ 400ms/div

Roll mode: 1s/div ~ 1h/div

Range

10 divisions

Buffer Size

10K ~ 1M

Trigger

Type

Hantek6102BE

Edge trigger

Hantek6212BE

Edge trigger, Pulse Trigger

Mode

Auto, Normal and Single

CH001366
€259.83

Hantek 6102BE PC USB Digital Storage Oscilloscope 100Mhz 2CH

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SR17E SR17C SR17D SR13J SR13H DH82HM86 DH82HM87 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000266
€5.40

SR17E SR17C SR17D SR13J SR13H DH82HM86 DH82HM87 Stencil Template

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LUPXA255A0C400 MARVELL

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000310
€24.62

LUPXA255A0C400 MARVELL

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2150708001 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000274
€5.40

215-0708001 Stencil Template

ZME350GBB22GT Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000248
€5.40

ZME350GBB22GT Stencil Template

wishlist
Compare

OZMICRO OZ8682

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000297
€3.45

OZMICRO OZ8682

wishlist
Compare

GK106875A1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000251
€6.47

GK106-875-A1 Stencil Template

wishlist
Compare

GMT G547I2P81U

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000302
€3.45

GMT G547I2P81U

wishlist
Compare

2160833132 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000265
€5.40

216-0833132 Stencil Template

wishlist
Compare

OZMICRO OZ813

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000303
€3.45

OZMICRO OZ813

wishlist
Compare

Hantek 6102BE PC USB Digital Storage Oscilloscope 100Mhz 2CH

Login to Download: * User Manual Buy Probe Accessories

Description

Hantek 6102BE PC USB Digital Storage Oscilloscope 100Mhz 2CH and EXT 250MS/s

Features:

Excellent industrial design-the same anodised aluminium casing as iPad,

which is not only beautiful and tasteful but also greatly enhanced the hardness of aluminum alloy surface,

and has good heat resistance and strong wearability.

Standard USBXI TM interface, easily inserts into USBXI TM housing to make up a combination instrument.

USB2.0 interface, no external power source required, easy to use.

Be suitable for notebook computer, product line maintenance,be used easily on business.

Dimensions (mm):190(L) x100(W) x35(H), be carried easily.

High performance, 250MS/s real-time sampling, 100MHz Bandwidth.

Operating System: Windows 7, Windows NT, Windows 2000, Windows XP,VISTA.

23 measurement functions, PASS/FAIL Check, be suitable for technical application.

Waveform average, persistence, intensity,invert,addition, subtraction, multiplication, division,X-Y plot.

Save waveform in the following: text file, jpg/bmp graphic file, MS excel/word file.

FFT

One computer can connect many DSO, extend channel easily.

LabviewVBVCDelphiC++Builder Second Design instance.

Specifications Table:

Input

Max. sample rate

Real-time sampling:

250MSa/s using one channel(Hantek6102BE)

250MSa/s using one channel(Hantek6212BE)

Channels

2

Bandwidth

100 MHz analog bandwidth(Hantek6102BE)

200 MHz analog bandwidth(Hantek6212BE)

Vertical Resolution

8 bits/channel (Hantek6102BE)

9 bits/channel (Hantek6212BE)

Gain range

Hantek6102BE

10mV ~5V/div @ x1 probe(1,2,5 sequence)

100mV ~ 50V/div @ x10 probe

1V ~ 500V/div @ x100 probe

10V ~ 5KV/div @ x1000 probe

Hantek6212BE

10mV ~10V/div @ x1 probe(1,2,5 sequence)

100mV ~100V/div @ x10 probe

1V ~ 1000V/div @ x100 probe

10V ~ 10KV/div @ x1000 probe

Range

8 divisions

Offset level

+/-4 divisions

Coupling

AC, DC,GND

Offset increments

0.02 div

Impedance

1M ohm

DC accuracy

+/-3%

Input protection

35Vpk (DC + peak AC < 10 kHz, without external attenuation)

Display Mode

Y-T, X-Y and Roll

Timebase

Timebase range

Hantek6102BE

4ns/div-1h/div(1-2-4 sequence)

Hantek6212BE

2ns/div-1h/div(1-2-4 sequence)

Acquisition mode

Hantek6102BE

Real-time sampling: 4ns/div-400ms/div.

Roll mode: 1s/div-1h/div

Hantek6212BE

Equivalent sampling: 2ns/div ~ 4us/div

Real-time sampling: 10us/div ~ 400ms/div

Roll mode: 1s/div ~ 1h/div

Range

10 divisions

Buffer Size

10K ~ 1M

Trigger

Type

Hantek6102BE

Edge trigger

Hantek6212BE

Edge trigger, Pulse Trigger

Mode

Auto, Normal and Single

CH001366
€259.83

Hantek 6102BE PC USB Digital Storage Oscilloscope 100Mhz 2CH

wishlist
Compare

SR17E SR17C SR17D SR13J SR13H DH82HM86 DH82HM87 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000266
€5.40

SR17E SR17C SR17D SR13J SR13H DH82HM86 DH82HM87 Stencil Template

wishlist
Compare

LUPXA255A0C400 MARVELL

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000310
€24.62

LUPXA255A0C400 MARVELL

wishlist
Compare

2150708001 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000274
€5.40

215-0708001 Stencil Template

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