Silicone Heat Mat Set: * Silicone Heat Mat Repair Insulation Kit Mobile Computer Tablets Phones Fix Pad

BD82QM77 SLJ8A

Part Number BD82QM77 SLJ8A Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 13+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Original antistatic QUICK 236 ESD fast gram display lead-free welding iron 90w display specification soldering station

QUICK236ESD digital display characteristics of lead-free soldering station:

microcomputer digital display, PID temperature control, temperature and fast rebound, truly lead-free soldering.

adopted high temperature ceramic heater, long service life.can be with many long life general type welding head, easy to use.

using digital temperature calibration, easy to operate. light soldering irons, use comfortable.novel appearance, structure is firm.

antistatic design.

Detail

Power 90W

Voltage AC 220V

Temperature Range 80 ~ 480

Dimensions 60 (L) 105 (W) 125 (H) mm

Weight About 3.65 kg

Temperature stability 2

Tip over the ground impedance < 2 O

Tip over the ground voltage < 2 mv

Package

1*Host

1*tweezers

1*Ground wire

1*English manual

1*Handle

1*Handle stand

1*Sponge mats

1*Power cable

1*original quick soldering iron tips

G94-701-A1

Part Number G94-701-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 0910

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

LVDS Cable for screen Lenovo G40-45 G40-30 G40-75 Z40-70 Z40-45 Ver.1 p/n: DC02001M600

GF-GO7900TGTXHN-A2

Part Number GF-GO7900TGTXHN-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 0931

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

216-0674024

Part Number 216-0674024 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 0923

Package/Case 500 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

NEW UNO R3 ATmega328P CH340 Mini USB Board for Compatible-Arduino FF

Features:

Open circuit diagram of the original design, the development of software interface for free download, can also be in accordance with the requirements and their modified, download the program is simple and convenient. Can simply use sensors, all kinds of electronic components connection (such as: LED lights, buzzer, buttons, photoresistance, etc.), make all sorts of interesting work.Microprocessor controller, using high-speed development interface and the environment are very simple and easy to understand, very suitable for beginners to learn.

Main Changes from the older version:

- Add two rows of the holes for the pins. So it can be connected with normal Dubond line.

- Add 3 rows of the holes for wiring.

- Change the in-line package of ATMEGA328P to flat package.

- CH340G Replace ATmega16U2

- Plug UNO development board, the driver will be automatically installed.

- Select the board UNO inside the die.

- Select the COM port, this can be in my computer queries, just inside your uno port development board

-You'd better to choose arduino own routine procedures, burn into the board?

Package Included:

1 x Arduino UNO R3 ATmega328P CH340 USB Development Board

AC82GL40 SLB95

Part Number AC82GL40 SLB95 Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 11+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

GL82Q150 SR2C6

Part Number GL82Q150 SR2C6 Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 15+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock