LVDS Cable for screen Samsung RV408 RV410 RV411 RV412 RV415 RV420 p/n: BA39-01023A

EM2100ICJ23HM E1-2100

Part Number EM2100ICJ23HM Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 14+

Package/Case 360 Description Original new

EM2100ICJ23HM E1-2100 Processor AMD Mobile CPU BGA769 1.0 GHz Cores2

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

2.5 Inch Tray Caddy Sled ProLiant for HP 651687-001 Gen8 G8 DL380

SR1SE N3520

Part Number SR1SE N3520 Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 1346

Package/Case 240 PCS Description Original new

SR1SE N3520 FH8065301616103 Intel Pentium CPU BGA1170 2 16 GHz Cores4

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

A. function

1 measurement of electrical parameters (voltage, current, active power, power).

2 overload alarm function (over power alarm threshold, backlight and power flashing tips).

3 power alarm threshold preset function (can set their own power alarm threshold).

4 power button reset function.

5 power down data storage function.

6 screen LCD LCD screen full display function (at the same time display voltage, current, active power, power).

7 backlight function.

B. display and key

I. display interface

Display large screen LCD LCD screen display voltage, current, power, power parameters.

II. Display format

1 power: test range 0~4.5kW

0.0~999.9W display format 1kW;

1kW display format 1000~4500W.

2 power: test range 0~9999kWh

0~9999Wh display format 10kWh;

10kWh display format 10~9999kWh;

3 voltage: test range 80~260V

Display format 80~220V

4 current: test range 0~20A

Display format 0.00~20.00.

III. Key

1 backlight control

By pressing the button to turn on or turn off the backlight, backlight power down automatically save.

2 power cleared

Step 1: long press the button for 5 seconds until the number of the display window flashes, and then release the button;

Step 2: if you press the button again, the amount of data cleared and exit clear flicker state;

Step 3: if you press the button for as long as 5 seconds until it is no longer flashing, it means that the electricity data is not cleared and exit cleared state.

3 power alarm setting

Step 1: long press the button, when the LCD screen display "SET CLr" after the release button, enter the power value set state;

Step 2: power region shows the current value and the minimum power alarm digital start flashing, then through the press button on the digital +1, when there is no key operation for more than 3 seconds, automatically switch to digital, setting method;

Step 3: set up after the completion of the long press button for more than 5 seconds to automatically save the exit, the active power threshold setting range of 0 ~ 4.5kW.

C. notes

The 1 module is suitable for indoor and outdoor use can not.

2 the load should not exceed the rated power.

3 wiring order can not be mistaken.

D. specification parameters

1 working voltage: 80 ~ 260VAC

2 test voltage: 80 ~ 260VAC

2 rated power: 20A/4500W

3 operating frequency: 45-65Hz

4 measurement accuracy: 1.0

216-0809000 HD6470

Part Number 216-0809000 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 360 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

LVDS Cable for screen Acer 5635 LED p/n: dd0zr6lc100

N11M-PT1-S-B1

Part Number N11M-PT1-S-B1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1332

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Arabic 78 Keys Wireless Keyboard Bluetooth Ultra Slim for iPad/Windows OS/Mac/Android

218-0755111

Part Number 218-0755111 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 14+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

WINGONEER ESP-12E ESP8266 UART WIFI Wireless Shield for Arduino UNO R3

Features:

Standard pin interface to achieve full compatibility with the pitch Arduino Uno, Mega and so on. (Unless the standard size arduino, such as Nano, Mini)

3.3V power supply using advanced chip (with the official expansion board power chip CC3000 same), so 3.3V Arduino board provided more accurate, so ESP8266 as official cc3000 chip work as normal, there is no gap.

It leads to a WiFi module power supply / service interface to facilitate developers to extend the power supply and maintenance.

Onboard ESP8266-12 stable industrial grade serial WiFi module, using an enhanced PCB antenna, signal better.

Product Dimensions: 2.79 x 14.61 x 13.59 cm

Weight: 0.49 kg

Product description:

WINGONEER(R) trademark Reg.NO:012678447

WINGONEER ESP-12E ESP8266 UART WIFI Wireless Shield for Arduino UNO R3

Description:

You can quickly switch DIP switch ESP8266-12 industrial grade WiFi stable operation mode (such as operating mode and upgrade mode) module, integrated serial chip, quickly flashing the firmware.

Built-in 5V to 3.3V TTL level converter to prevent high-pressure Arduino TTL level of the WiFi module damage.

Onboard ESP8266-12 stable industrial grade WiFi module with a metal shield, immunity to interference.

Onboard ESP8266-12 standard pitch leads to a stable industrial grade WiFi module all interfaces, enabling developers to easily develop deep.

Use stackable design, it can continue to accumulate above the other modules, easy to use.

Onboard four LED displays the status of ESP8266, namely PWR, DFU, AP, STA

Package Included:

1x WINGONEER ESP8266 ESP-12E UART WIFI Wireless Shield TTL Converter for Arduino UNO R3 Mega

216-0769010 HD5850

Part Number 216-0769010 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 10+

Package/Case 360 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock