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N15SGTBA2

N15S-GT-B-A2

Part Number N13P-GV2-S-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 14+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004961
€27.57

N15S-GT-B-A2

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015mm Titanium alloy antimagnetization tweezers Bending type

Buy Tweezers Set: * VETUS ESD-10 ESD-11 ESD-12 ESD-13 ESD-14 ESD-15 ESD-16

Features:

Made of high quality titanium alloy, strong and stretching, strong corrosion and magnetic resistance, long service life.

Hard, sharp and accurate, picks up 0.02mm flying lines.

Options:

Type: Straight/Bend

Material: Titanium alloy

Length: Approx.14cm/5.51in

Edge: 0.15mm

Net weight: Approx.14g

Package includes:

1pc. Industrial tweezers

CH003789
€14.79

0.15mm Titanium alloy antimagnetization tweezers Bending type

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G84602A2 8600MGT 64Bit 128Mb

G84-602-A2 8600MGT 64Bit 128Mb

Part Number G84-602-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1244

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004977
€17.23

G84-602-A2 8600MGT 64Bit 128Mb

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N16EGSKABA1

N16E-GS-KAB-A1

Part Number N16E-GS-KAB-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004981
€131.28

N16E-GS-KAB-A1

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GFGO7600HNA2

GF-GO7600-H-N-A2

Part Number GF-GO7600-H-N-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1027

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004994
€24.62

GF-GO7600-H-N-A2

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2160774207 HD6370

216-0774207 HD6370

Part Number 216-0774207 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 11+

Package/Case 400 Description Manufacturer renovation

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004995
€22.64

216-0774207 HD6370

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N17EQ1A1

N17E-Q1-A1

Part Number N17E-Q1-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005000
€410.26

N17E-Q1-A1

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MCP67DA3

MCP67D-A3

Part Number MCP67D-A3 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 0818

Package/Case 240 PCS Description Bulk new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005050
€31.15

MCP67D-A3

N15SGTBA2

N15S-GT-B-A2

Part Number N13P-GV2-S-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 14+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004961
€27.57

N15S-GT-B-A2

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015mm Titanium alloy antimagnetization tweezers Bending type

Buy Tweezers Set: * VETUS ESD-10 ESD-11 ESD-12 ESD-13 ESD-14 ESD-15 ESD-16

Features:

Made of high quality titanium alloy, strong and stretching, strong corrosion and magnetic resistance, long service life.

Hard, sharp and accurate, picks up 0.02mm flying lines.

Options:

Type: Straight/Bend

Material: Titanium alloy

Length: Approx.14cm/5.51in

Edge: 0.15mm

Net weight: Approx.14g

Package includes:

1pc. Industrial tweezers

CH003789
€14.79

0.15mm Titanium alloy antimagnetization tweezers Bending type

wishlist
Compare

G84602A2 8600MGT 64Bit 128Mb

G84-602-A2 8600MGT 64Bit 128Mb

Part Number G84-602-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1244

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004977
€17.23

G84-602-A2 8600MGT 64Bit 128Mb

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Compare

N16EGSKABA1

N16E-GS-KAB-A1

Part Number N16E-GS-KAB-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004981
€131.28

N16E-GS-KAB-A1

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GFGO7600HNA2

GF-GO7600-H-N-A2

Part Number GF-GO7600-H-N-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1027

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004994
€24.62

GF-GO7600-H-N-A2

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2160774207 HD6370

216-0774207 HD6370

Part Number 216-0774207 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 11+

Package/Case 400 Description Manufacturer renovation

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004995
€22.64

216-0774207 HD6370

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Compare

N17EQ1A1

N17E-Q1-A1

Part Number N17E-Q1-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005000
€410.26

N17E-Q1-A1

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Compare

MCP67DA3

MCP67D-A3

Part Number MCP67D-A3 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 0818

Package/Case 240 PCS Description Bulk new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005050
€31.15

MCP67D-A3

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