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BD82Z68 SLJ4F Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001104
€5.40

BD82Z68 SLJ4F Stencil Template

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DC Power Jack Part PJ052

Dell Latitude DC Power Jack Connector: E5410, E5510

Dell Studio Series DC Power Jack Connector: 1569

HP Compaq NC Series DC Power Jack Connector: NC8430

HP Compaq NW Series DC Power Jack Connector: NW8440, NW9440

HP Compaq NX Series DC Power Jack Connector: NX7300, NX7400, NX8420, NX9410, NX9420

HP Elitebook DC Power Jack Connector: 6930P

HP Mini 2100 Notebook PC Series DC Power Jack Connector: 2133, 2140

CH001105
€7.21

DC Power Jack, Part #PJ052

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Trackpad Touchpad Mouse without cable MacBook Air13A1466 2013 2014 2015

Trackpad Touchpad Mouse without cable MacBook Air13" A1466 2013 2014 2015

Product Name

Trackpad Touchpad Mouse without Cable for Apple MacBook Air 13" A1466 2013 2014 2015

Compatible Model

MacBook Air 13" A1466 2013 2014 2015

Compatible Subfamily

MacBook Air "Core i5" 1.3 13" (Mid-2013)

MacBook Air "Core i7" 1.7 13" (Mid-2013)

MacBook Air "Core i5" 1.4 13" (Early 2014)

MacBook Air "Core i7" 1.7 13" (Early 2014)

MacBook Air "Core i5" 1.6 13" (Early 2015)

MacBook Air "Core i7" 2.2 13" (Early 2015)

CH001107
€47.24

Trackpad Touchpad Mouse without cable MacBook Air13A1466 2013 2014 2015

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TI AM82801IUX SLB8N

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001108
€10.33

TI AM82801IUX SLB8N

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XILINX Platform USB Download Cable Jtag Programmer for FPGA CPLD CMod XC2C64A D

Login to Download: * User manual

Feature:

1. Support all Xilinx devices:

All Virtex FPGA families;

All Spartan FPGA families;

XC9500/XC9500XL/XC9500XV CPLDs;

CoolRunner XPLA3/CoolRunner-II CPLDs;

XC18V00 IPS Proms;

XCF00S/XCF00P Platform Flash PROMS;

XC4000 series FPGAs.

2. Supported on Windows and Red Hat Enterprise Linux.

3. Work with impact,chipscope pro and microblaze embedded processer debugging.

4. Support target system using 5.0V TTL,3.3V LVTTL/LVCMOS,2.5V,1.8V,1.5V.

5. Apply to Xilinx CPLD/FPGA chips download debugging.

6. Support JTAG,Slave Serial,SPI download mode,can configure all Xilinx devices.

7. Xilinx Platform with USB Cable fully compatible.

8. Target device to download the clock options,up to 24MHz.

9. Support Impact and ChipScope.

10. Firmware can be updated automatically.

Package included:

1 x Xilinx Platform Cable USB

1 x 10-pin 2.54mm pitch 15cm flat cable

1 x 14-pin 2.0mm pitch 15cm flat cable

1 x 14-pin 2.54mm pitch 15cm flat cable

1 x 7-pin fly duppont cables

1 x Adapter plate

1 x 6-pin cable

1 x USB Cable

CH001109
€24.74

XILINX Platform USB Download Cable Jtag Programmer for FPGA CPLD C-Mod XC2C64A D

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Maxim MAX17511

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001110
€3.45

Maxim MAX17511

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N16EGXXA1

N16E-GXX-A1

Part Number N16E-GXX-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001111
€196.92

N16E-GXX-A1

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SKYWORKS SKY7754132

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001112
€4.77

SKYWORKS SKY77541-32

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NUVOTON NPCE885GA0DX

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001113
€3.45

NUVOTON NPCE885GA0DX

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K4G41325FCHC03

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001115
€12.71

K4G41325FC-HC03

BD82Z68 SLJ4F Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001104
€5.40

BD82Z68 SLJ4F Stencil Template

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DC Power Jack Part PJ052

Dell Latitude DC Power Jack Connector: E5410, E5510

Dell Studio Series DC Power Jack Connector: 1569

HP Compaq NC Series DC Power Jack Connector: NC8430

HP Compaq NW Series DC Power Jack Connector: NW8440, NW9440

HP Compaq NX Series DC Power Jack Connector: NX7300, NX7400, NX8420, NX9410, NX9420

HP Elitebook DC Power Jack Connector: 6930P

HP Mini 2100 Notebook PC Series DC Power Jack Connector: 2133, 2140

CH001105
€7.21

DC Power Jack, Part #PJ052

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Trackpad Touchpad Mouse without cable MacBook Air13A1466 2013 2014 2015

Trackpad Touchpad Mouse without cable MacBook Air13" A1466 2013 2014 2015

Product Name

Trackpad Touchpad Mouse without Cable for Apple MacBook Air 13" A1466 2013 2014 2015

Compatible Model

MacBook Air 13" A1466 2013 2014 2015

Compatible Subfamily

MacBook Air "Core i5" 1.3 13" (Mid-2013)

MacBook Air "Core i7" 1.7 13" (Mid-2013)

MacBook Air "Core i5" 1.4 13" (Early 2014)

MacBook Air "Core i7" 1.7 13" (Early 2014)

MacBook Air "Core i5" 1.6 13" (Early 2015)

MacBook Air "Core i7" 2.2 13" (Early 2015)

CH001107
€47.24

Trackpad Touchpad Mouse without cable MacBook Air13A1466 2013 2014 2015

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TI AM82801IUX SLB8N

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001108
€10.33

TI AM82801IUX SLB8N

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XILINX Platform USB Download Cable Jtag Programmer for FPGA CPLD CMod XC2C64A D

Login to Download: * User manual

Feature:

1. Support all Xilinx devices:

All Virtex FPGA families;

All Spartan FPGA families;

XC9500/XC9500XL/XC9500XV CPLDs;

CoolRunner XPLA3/CoolRunner-II CPLDs;

XC18V00 IPS Proms;

XCF00S/XCF00P Platform Flash PROMS;

XC4000 series FPGAs.

2. Supported on Windows and Red Hat Enterprise Linux.

3. Work with impact,chipscope pro and microblaze embedded processer debugging.

4. Support target system using 5.0V TTL,3.3V LVTTL/LVCMOS,2.5V,1.8V,1.5V.

5. Apply to Xilinx CPLD/FPGA chips download debugging.

6. Support JTAG,Slave Serial,SPI download mode,can configure all Xilinx devices.

7. Xilinx Platform with USB Cable fully compatible.

8. Target device to download the clock options,up to 24MHz.

9. Support Impact and ChipScope.

10. Firmware can be updated automatically.

Package included:

1 x Xilinx Platform Cable USB

1 x 10-pin 2.54mm pitch 15cm flat cable

1 x 14-pin 2.0mm pitch 15cm flat cable

1 x 14-pin 2.54mm pitch 15cm flat cable

1 x 7-pin fly duppont cables

1 x Adapter plate

1 x 6-pin cable

1 x USB Cable

CH001109
€24.74

XILINX Platform USB Download Cable Jtag Programmer for FPGA CPLD C-Mod XC2C64A D

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Maxim MAX17511

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001110
€3.45

Maxim MAX17511

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N16EGXXA1

N16E-GXX-A1

Part Number N16E-GXX-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001111
€196.92

N16E-GXX-A1

wishlist
Compare

SKYWORKS SKY7754132

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001112
€4.77

SKYWORKS SKY77541-32

wishlist
Compare

NUVOTON NPCE885GA0DX

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001113
€3.45

NUVOTON NPCE885GA0DX

wishlist
Compare

K4G41325FCHC03

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001115
€12.71

K4G41325FC-HC03

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