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i7620M SLBZT Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001153
€5.40

i7-620M SLBZT Stencil Template

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50ml Multifunctional Adhesive Glue B7000 For Mobile Phone Universal

Description:

100% brand new and high quality

Repair rubber dock bumpers

Seal plastic containers

Repair stripped threads in wood

Specation:

Material: plastic shell + glue

Color: as pic shows

Length: approx. 5.9inch/15cm

Width: approx. 1.85inch/4.7cm

Model: B-7000

Net weight: 1.68fl.oz (50ml)

Solid content: 30% - 35%

After curing Hardness: 65-80A

Surface drying time: 3 minutes

Full cure time: 24-48 hours

Storage: stored at 10 degrees to 28 degrees

Method of use:

Please read carefully before using the product instruction

Large area before use, please do small area test

Please make sure that the sticking surface cleaning and drying

The best use of temperature should be between 18-32 degrees

The product after opening the cover please timely cover titch removal for the adhesive residue on the cover

Wait for 1-2 minutes , two adherend aligment bonding a little pressure

It is straight hours can be after 48 hours to achieve the best bonding strength

The product does not use the bottle cap to prevent glue after contacting air curing

Package included:

1x Strength Glue

CH001154
€4.85

50ml Multi-functional Adhesive Glue B-7000 For Mobile Phone Universal

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SC414456LB0VR 18250206

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001155
€30.18

SC414456LB0VR (1825-0206)

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Maxim MAX1718BEEI

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001156
€3.45

Maxim MAX1718BEEI

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Intersil ISL62392HRTZ

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001157
€3.45

Intersil ISL62392HRTZ

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10g Japan goot BS10 BGA Reballing repair Flux paste

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001158
€5.35

10g Japan goot BS-10 BGA Reballing repair Flux paste

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Compare
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PS80A Digital Ultrasonic Cleaner Stainless Steel Heater Timer Industrial Grade 22L

Login to Download: * Manual Download

Product Description

The ultrasonic cleaner is a microprocessor-controlled device that uses ultrasonic or high frequency sound waves to clean jewelry and other delicate items. Ultrasonic cleaning is based on the cavitation effect caused by high frequency ultrasonic wave vibration signals in fluid. Microscopic bubbles that expand and rapidly collapse cause cavitation, which creates an effective cleaning action on the surface of object being cleaned. Additionally, the bubbles are small enough to penetrate even microscopic crevices, cleaning them thoroughly and consistently.

High efficiency saves cleaning solvent, thermal energy, work place and labor!

Six sets of built-in powerful transducers can strengthen the ultrasonic power and make superior cleaning outcome. It is utilization of digital program in ultrasonic cleaner to control the unit, according to the quantity and condition of the items to be cleaned to choose a working cycle time. As a result, it is more convenient and efficient than hand wash, steam cleaners, high pressure water jet cleaning or other machines.

Advanced Brushed Stainless Steel Cleaning Tank to avoid corrosion water stain and keep the tank looking always new.

(In comparison, the common stainless steel cleaning tanks will be dirty yellow corrosion water stain on the surface after a long time of using, and it's hard to be removed.)

Application

Professional Use:

Medical and Dental Clinics, Tattoo Shops, Scientific Labs and Golf Clubs.

Jewelers, Opticians, Watchmakers, Antique Dealers and Electronics Workshops etc.

Personal or Home Use:

Jewelry: Earrings, Necklace, Rings, Bracelets and Diamonds.

Glasses and Timepieces: Glasses, Sunglasses, Optical Lenses, Contact Lens Accessories, Watch Chains and Waterproof Watches.

Commodities: Tattoo Guns and Tubes, Electric Shaver Heads, Razor Blades, Dentures, Combs and Toothbrushes.

Stationery: Pen-heads, Printer-heads, Inkjet Cartridges and Seals.

Metal Articles: Ancient Coins, Badges, Valves, Machine Nozzles, Electronics Components and Mechanical Parts.

Metal Dishware: Forks, Knives, Spoons and Other Small Silverwares etc.

CH001159
€315.77

PS-80A Digital Ultrasonic Cleaner Stainless Steel Heater Timer Industrial Grade 22L

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AMZL3250AX5DY Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001160
€5.40

AMZL3250AX5DY Stencil Template

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Compare
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Intersil ISL6264

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001161
€3.45

Intersil ISL6264

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NT71206FG603

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001162
€3.45

NT71206FG-603

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Maxim MAX1549

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001163
€3.45

Maxim MAX1549

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VT8251CE

VT8251CE

Part Number VT8251CE Manufacturer VIA

BGA Alloy No Pb/Lead Free Date Code 0921

Package/Case 1 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001164
€10.64

VT8251CE

i7620M SLBZT Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001153
€5.40

i7-620M SLBZT Stencil Template

wishlist
Compare

50ml Multifunctional Adhesive Glue B7000 For Mobile Phone Universal

Description:

100% brand new and high quality

Repair rubber dock bumpers

Seal plastic containers

Repair stripped threads in wood

Specation:

Material: plastic shell + glue

Color: as pic shows

Length: approx. 5.9inch/15cm

Width: approx. 1.85inch/4.7cm

Model: B-7000

Net weight: 1.68fl.oz (50ml)

Solid content: 30% - 35%

After curing Hardness: 65-80A

Surface drying time: 3 minutes

Full cure time: 24-48 hours

Storage: stored at 10 degrees to 28 degrees

Method of use:

Please read carefully before using the product instruction

Large area before use, please do small area test

Please make sure that the sticking surface cleaning and drying

The best use of temperature should be between 18-32 degrees

The product after opening the cover please timely cover titch removal for the adhesive residue on the cover

Wait for 1-2 minutes , two adherend aligment bonding a little pressure

It is straight hours can be after 48 hours to achieve the best bonding strength

The product does not use the bottle cap to prevent glue after contacting air curing

Package included:

1x Strength Glue

CH001154
€4.85

50ml Multi-functional Adhesive Glue B-7000 For Mobile Phone Universal

wishlist
Compare

SC414456LB0VR 18250206

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001155
€30.18

SC414456LB0VR (1825-0206)

wishlist
Compare

Maxim MAX1718BEEI

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001156
€3.45

Maxim MAX1718BEEI

wishlist
Compare

Intersil ISL62392HRTZ

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001157
€3.45

Intersil ISL62392HRTZ

wishlist
Compare

10g Japan goot BS10 BGA Reballing repair Flux paste

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001158
€5.35

10g Japan goot BS-10 BGA Reballing repair Flux paste

wishlist
Compare

PS80A Digital Ultrasonic Cleaner Stainless Steel Heater Timer Industrial Grade 22L

Login to Download: * Manual Download

Product Description

The ultrasonic cleaner is a microprocessor-controlled device that uses ultrasonic or high frequency sound waves to clean jewelry and other delicate items. Ultrasonic cleaning is based on the cavitation effect caused by high frequency ultrasonic wave vibration signals in fluid. Microscopic bubbles that expand and rapidly collapse cause cavitation, which creates an effective cleaning action on the surface of object being cleaned. Additionally, the bubbles are small enough to penetrate even microscopic crevices, cleaning them thoroughly and consistently.

High efficiency saves cleaning solvent, thermal energy, work place and labor!

Six sets of built-in powerful transducers can strengthen the ultrasonic power and make superior cleaning outcome. It is utilization of digital program in ultrasonic cleaner to control the unit, according to the quantity and condition of the items to be cleaned to choose a working cycle time. As a result, it is more convenient and efficient than hand wash, steam cleaners, high pressure water jet cleaning or other machines.

Advanced Brushed Stainless Steel Cleaning Tank to avoid corrosion water stain and keep the tank looking always new.

(In comparison, the common stainless steel cleaning tanks will be dirty yellow corrosion water stain on the surface after a long time of using, and it's hard to be removed.)

Application

Professional Use:

Medical and Dental Clinics, Tattoo Shops, Scientific Labs and Golf Clubs.

Jewelers, Opticians, Watchmakers, Antique Dealers and Electronics Workshops etc.

Personal or Home Use:

Jewelry: Earrings, Necklace, Rings, Bracelets and Diamonds.

Glasses and Timepieces: Glasses, Sunglasses, Optical Lenses, Contact Lens Accessories, Watch Chains and Waterproof Watches.

Commodities: Tattoo Guns and Tubes, Electric Shaver Heads, Razor Blades, Dentures, Combs and Toothbrushes.

Stationery: Pen-heads, Printer-heads, Inkjet Cartridges and Seals.

Metal Articles: Ancient Coins, Badges, Valves, Machine Nozzles, Electronics Components and Mechanical Parts.

Metal Dishware: Forks, Knives, Spoons and Other Small Silverwares etc.

CH001159
€315.77

PS-80A Digital Ultrasonic Cleaner Stainless Steel Heater Timer Industrial Grade 22L

wishlist
Compare

AMZL3250AX5DY Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001160
€5.40

AMZL3250AX5DY Stencil Template

wishlist
Compare

Intersil ISL6264

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001161
€3.45

Intersil ISL6264

wishlist
Compare

NT71206FG603

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001162
€3.45

NT71206FG-603

wishlist
Compare

Maxim MAX1549

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001163
€3.45

Maxim MAX1549

wishlist
Compare

VT8251CE

VT8251CE

Part Number VT8251CE Manufacturer VIA

BGA Alloy No Pb/Lead Free Date Code 0921

Package/Case 1 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001164
€10.64

VT8251CE

wishlist
Compare
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