Please note: Due to too many models, the factory can only guarantee 90% model accuracy, about 10% error, please understand!
0.25mm (pitch=0.5mm)
0.3mm (pitch=0.58mm)
0.3mm (pitch=0.5mm)
0.35mm (pitch=0.65mm)
0.35mm (pitch=0.6mm)
0.4mm (pitch=0.7mm)
0.45mm (pitch=0.78mm)
0.5mm 35*35 (pitch=0.78mm)
0.5mm 40*40 (pitch=0.81mm) 0.5mm (pitch=0.8mm)
0.55mm (pitch=1.02mm)
0.6mm (pitch=0.9mm)
0.6mm 24*24 (pitch=0.99mm)
0.6mm (pitch=1.0mm)
0.6mm 27*27 (pitch=0.99mm)
0.6mm (pitch=1.1mm)
0.6mm 30*30 (pitch=0.99mm)
0.6mm 33*33 (pitch=0.99mm) 0.6mm 41*41 (pitch=1.01mm)
0.65mm (pitch=1.0mm)
0.76mm 30*30 (pitch=1.27mm)
0.76mm 33*33 (pitch=1.27mm)
0.76mm 34*34 (pitch=1.27mm)
0.76mm 37*37 (pitch=1.27mm)
0.76mm 41*41 (pitch=1.27mm)
0.76mm (pitch=1.27mm)
1.0mm (pitch=1.5mm)
Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
