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  • Categories: Other BGA Chips & ICs
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ITE IT8517VG HX0

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000374
€3.45

ITE IT8517VG HX0

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RICHTEK RT8152A

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000375
€3.45

RICHTEK RT8152A

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TI TPS51125A

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000381
€3.45

TI TPS51125A

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NEC 2R5102

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000385
€3.45

NEC 2R5102

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10m USB C Cable HiSpeed Type C to Type C Connector Data Cable

Powerful Backup Charge Cable:

As fast as your original USB-C cable. Best choice to backup for home, work or travel.

High Speed Syncing:

Transfer data from all your USB-C devices at speeds of up to 480 Mbps.

Reversible Connector:

USB-C's user-friendly design helps you plug and unplug easily without checking for the connector orientation.

High Quality:

CHOE usb type c cable with sturdy construction has connectors with molded strain relief for frequent unplugging and durability.

Popular USB C Cable Compatibility List:

For Apple(2015) new MacBook with 12" Retina Display

For 2015 Google Chromebook Pixel

For HP Pavilion x2

For Nokia N1

For Lenovo Zuk Z1

For Google Nexus 5X / 6P

For Google Pixel C

For Microsoft Lumia 950 / 950 XL

For ASUS Z580C tablet

And More

Specifications

Item: USB Type C Cable

Current Output: 5V 3A(Max)

Date Transfer: USB 2.0/480Mbps

Important Note:

1.Compatible with the USB Type-C port on the Apple USB-C Digital AV Multiport Adapter for charging only.

2.This cable is not compatible with OnePlus 2.

1 x USB Type C Cable

CH004282
€8.33

1.0m USB C Cable Hi-Speed Type C to Type C Connector Data Cable

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apple 338S1077

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000386
€7.94

apple 338S1077

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TI BQ2084

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000388
€3.45

TI BQ2084

ITE IT8517VG HX0

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000374
€3.45

ITE IT8517VG HX0

wishlist
Compare

RICHTEK RT8152A

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000375
€3.45

RICHTEK RT8152A

wishlist
Compare

TI TPS51125A

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000381
€3.45

TI TPS51125A

wishlist
Compare

NEC 2R5102

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000385
€3.45

NEC 2R5102

wishlist
Compare

10m USB C Cable HiSpeed Type C to Type C Connector Data Cable

Powerful Backup Charge Cable:

As fast as your original USB-C cable. Best choice to backup for home, work or travel.

High Speed Syncing:

Transfer data from all your USB-C devices at speeds of up to 480 Mbps.

Reversible Connector:

USB-C's user-friendly design helps you plug and unplug easily without checking for the connector orientation.

High Quality:

CHOE usb type c cable with sturdy construction has connectors with molded strain relief for frequent unplugging and durability.

Popular USB C Cable Compatibility List:

For Apple(2015) new MacBook with 12" Retina Display

For 2015 Google Chromebook Pixel

For HP Pavilion x2

For Nokia N1

For Lenovo Zuk Z1

For Google Nexus 5X / 6P

For Google Pixel C

For Microsoft Lumia 950 / 950 XL

For ASUS Z580C tablet

And More

Specifications

Item: USB Type C Cable

Current Output: 5V 3A(Max)

Date Transfer: USB 2.0/480Mbps

Important Note:

1.Compatible with the USB Type-C port on the Apple USB-C Digital AV Multiport Adapter for charging only.

2.This cable is not compatible with OnePlus 2.

1 x USB Type C Cable

CH004282
€8.33

1.0m USB C Cable Hi-Speed Type C to Type C Connector Data Cable

wishlist
Compare

apple 338S1077

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000386
€7.94

apple 338S1077

wishlist
Compare

TI BQ2084

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000388
€3.45

TI BQ2084

wishlist
Compare
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