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  • Categories: Apple Parts, BIOS EMC, SMC
  • Categories: CPU and Graphic Chips
  • Categories: Pin Holder
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G84950A2

G84-950-A2

Part Number G84-950-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1215

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000492
€52.51

G84-950-A2

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2160810005 HD6750

216-0810005 HD6750

Part Number 216-0810005 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 17+

Package/Case 360 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000499
€64.08

216-0810005 HD6750

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Apple BIOS MBA 13 2012 A1466 8203209 EMC2559

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001168
€30.71

Apple BIOS MBA 13 2012 A1466 820-3209 EMC2559

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MCP77MVA2

MCP77MV-A2

Part Number MCP77MV-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 0932

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000508
€26.06

MCP77MV-A2

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G92720A2 8800MGTS

G92-720-A2 8800MGTS

Part Number G92-720-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 14+

Package/Case 210 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000518
€48.90

G92-720-A2 8800MGTS

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POWER SUPPLY 310W Apple iMac 27 A1312 Mid 2011 MC813 MC814 PA231102A

COMPATIBILITY

iMac 27" A1312

iMac10,1 Late 2009: MB952LL/A (3.06 GHz Core 2 Duo)

iMac10,1 Late 2009: MB952LL/A (3.33 GHz Core 2 Duo)

iMac11,1 Late 2009: MB953LL/A (2.66 GHz Core i5)

iMac11,1 Late 2009: MB953LL/A (2.8 GHz Core i7)

iMac11,3 Mid 2010: MC510LL/A (3.2 GHz Core i3)

iMac11,3 Mid 2010: MC511LL/A (2.8 GHz Core i5)

iMac11,3 Mid 2010: MC511LL/A (3.6 GHz Core i5)

iMac11,3 Mid 2010: MC511LL/A (2.93 GHz Core i7)

iMac12,2 Mid 2011: MC813LL/A (2.7 GHz Core i5)

iMac12,2 Mid 2011: MC814LL/A (3.1 GHz Core i5)

iMac12,2 Mid 2011: MD063LL/A (3.4 GHz Core i7)

IDENTIFYING NUMBERS

Apple Part #:661-5310, 661-5468, 661-5972

CH001229
€98.21

POWER SUPPLY 310W - Apple iMac 27 A1312 Mid 2011 MC813 MC814 PA-2311-02A

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N14MGEBA2

N14M-GE-B-A2

Part Number N14M-GE-B-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1428

Package/Case 360 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000550
€25.93

N14M-GE-B-A2

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Apple MACBOOK AIR 2011 A1369 A1370 A1377 64G 128G 256G SSD to 25 SATA converter ID16

Apple MACBOOK AIR 2011 A1369 A1370 A1377 64G 128G 256G ssd to 2.5 SATA converter ID16

GOODS DESCRIPTION:

PA5025A Apple MACBOOK AIR A1369 A1370 A1377 64G 128G 256G ssd to 2.5 SATA converter Adapter card

FEATURES

100% Brand NEW and High Quality

PA525 Apple MACBOOK AIR A1369 A1370 A1377 64G 128G 256G ssd to 3.5" SATA converter Adapter card is smaller than a 2.5 inch SATA HDD.

1. Only for APPLE MacBook Air MC505 MC503 MC506 MC968 MC969 MC965 = Late 2010 MacBook Air 3,1 (A1370)/3,2 (A1369)& Mid 2011 MacBook Air.

Fit the following SSD models from Apple MACBOOK AIR: A1369 A1370 1375 A1377 mc505 mc506 ssd:

toshiba THNSNC128GMDJ, toshiba THNSNC256GMDJ, Samsung MZ-CPA0640/0A2(64GB),Samsung MZ-CPA1280/0A2(128GB) ,Samsung MZ-CPA2560/0A5(256GB)

2. Not FIT 2.5 inch SATA HDD because the length of the adapter plate is bigger than 2.5 inch SATA HDD. Only converted to 2.5 inch SATA HDD

3. No need extra power adapter and any drivers .

4. Supports DOS, Win98/SE, 2000, Server 2003, XP, Vista, 7, Sever 2008 & Mac OS & Linux.

5.Compatible with both 3.3V and 5V Power.

6. dimension: 132mm x 43mm x 12mm

CH001309
€11.06

Apple MACBOOK AIR 2011 A1369 A1370 A1377 64G 128G 256G SSD to 2.5 SATA converter ID16

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SR23Y i55200U

SR23Y i5-5200U

Part Number SR23Y i5-5200U Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000551
€177.23

SR23Y i5-5200U

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DC IN USB Jack Encendido Audio Placa 8203057A Apple MacBook Air 13A1369 2011

DC IN USB Jack Power Audio Board 820-3057-A Apple MacBook Air 13A1369 2011

Product Condition:

Etat Neuf

Compatible Model:

MacBook Air 13A1369 2011

Compatible Subfamily:

MacBook Air "Core i51.6 13(Edu Only)

MacBook Air "Core i51.7 13(Mid-2011)

MacBook Air "Core i71.8 13(Mid-2011)

Compatible Model No:

MC965LL/A*, MD508LL/A*

CH001441
€47.12

DC IN USB Jack Encendido Audio Placa 820-3057-A Apple MacBook Air 13A1369 2011

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218S4PASA13G IXP450 SB450

218S4PASA13G IXP450 SB450

Part Number 218S4PASA13G Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 06+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000555
€11.93

218S4PASA13G IXP450 SB450

G84950A2

G84-950-A2

Part Number G84-950-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1215

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000492
€52.51

G84-950-A2

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2160810005 HD6750

216-0810005 HD6750

Part Number 216-0810005 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 17+

Package/Case 360 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000499
€64.08

216-0810005 HD6750

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Apple BIOS MBA 13 2012 A1466 8203209 EMC2559

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001168
€30.71

Apple BIOS MBA 13 2012 A1466 820-3209 EMC2559

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MCP77MVA2

MCP77MV-A2

Part Number MCP77MV-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 0932

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000508
€26.06

MCP77MV-A2

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New A1321 Battery For Apple Apple Macbook

Description :

Battery type: Li-ion

Battery Model: A1321

Battery Voltage: 10.95V

Battery Capacity: 73Whr

Color: Black

Compatibility : For Apple Macbook

Part Number : 020-6380-A

CH001184
€40.90

New A1321 Battery For Apple Apple Macbook

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G92720A2 8800MGTS

G92-720-A2 8800MGTS

Part Number G92-720-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 14+

Package/Case 210 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000518
€48.90

G92-720-A2 8800MGTS

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POWER SUPPLY 310W Apple iMac 27 A1312 Mid 2011 MC813 MC814 PA231102A

COMPATIBILITY

iMac 27" A1312

iMac10,1 Late 2009: MB952LL/A (3.06 GHz Core 2 Duo)

iMac10,1 Late 2009: MB952LL/A (3.33 GHz Core 2 Duo)

iMac11,1 Late 2009: MB953LL/A (2.66 GHz Core i5)

iMac11,1 Late 2009: MB953LL/A (2.8 GHz Core i7)

iMac11,3 Mid 2010: MC510LL/A (3.2 GHz Core i3)

iMac11,3 Mid 2010: MC511LL/A (2.8 GHz Core i5)

iMac11,3 Mid 2010: MC511LL/A (3.6 GHz Core i5)

iMac11,3 Mid 2010: MC511LL/A (2.93 GHz Core i7)

iMac12,2 Mid 2011: MC813LL/A (2.7 GHz Core i5)

iMac12,2 Mid 2011: MC814LL/A (3.1 GHz Core i5)

iMac12,2 Mid 2011: MD063LL/A (3.4 GHz Core i7)

IDENTIFYING NUMBERS

Apple Part #:661-5310, 661-5468, 661-5972

CH001229
€98.21

POWER SUPPLY 310W - Apple iMac 27 A1312 Mid 2011 MC813 MC814 PA-2311-02A

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N14MGEBA2

N14M-GE-B-A2

Part Number N14M-GE-B-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1428

Package/Case 360 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000550
€25.93

N14M-GE-B-A2

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Apple MACBOOK AIR 2011 A1369 A1370 A1377 64G 128G 256G SSD to 25 SATA converter ID16

Apple MACBOOK AIR 2011 A1369 A1370 A1377 64G 128G 256G ssd to 2.5 SATA converter ID16

GOODS DESCRIPTION:

PA5025A Apple MACBOOK AIR A1369 A1370 A1377 64G 128G 256G ssd to 2.5 SATA converter Adapter card

FEATURES

100% Brand NEW and High Quality

PA525 Apple MACBOOK AIR A1369 A1370 A1377 64G 128G 256G ssd to 3.5" SATA converter Adapter card is smaller than a 2.5 inch SATA HDD.

1. Only for APPLE MacBook Air MC505 MC503 MC506 MC968 MC969 MC965 = Late 2010 MacBook Air 3,1 (A1370)/3,2 (A1369)& Mid 2011 MacBook Air.

Fit the following SSD models from Apple MACBOOK AIR: A1369 A1370 1375 A1377 mc505 mc506 ssd:

toshiba THNSNC128GMDJ, toshiba THNSNC256GMDJ, Samsung MZ-CPA0640/0A2(64GB),Samsung MZ-CPA1280/0A2(128GB) ,Samsung MZ-CPA2560/0A5(256GB)

2. Not FIT 2.5 inch SATA HDD because the length of the adapter plate is bigger than 2.5 inch SATA HDD. Only converted to 2.5 inch SATA HDD

3. No need extra power adapter and any drivers .

4. Supports DOS, Win98/SE, 2000, Server 2003, XP, Vista, 7, Sever 2008 & Mac OS & Linux.

5.Compatible with both 3.3V and 5V Power.

6. dimension: 132mm x 43mm x 12mm

CH001309
€11.06

Apple MACBOOK AIR 2011 A1369 A1370 A1377 64G 128G 256G SSD to 2.5 SATA converter ID16

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SR23Y i55200U

SR23Y i5-5200U

Part Number SR23Y i5-5200U Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000551
€177.23

SR23Y i5-5200U

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DC IN USB Jack Encendido Audio Placa 8203057A Apple MacBook Air 13A1369 2011

DC IN USB Jack Power Audio Board 820-3057-A Apple MacBook Air 13A1369 2011

Product Condition:

Etat Neuf

Compatible Model:

MacBook Air 13A1369 2011

Compatible Subfamily:

MacBook Air "Core i51.6 13(Edu Only)

MacBook Air "Core i51.7 13(Mid-2011)

MacBook Air "Core i71.8 13(Mid-2011)

Compatible Model No:

MC965LL/A*, MD508LL/A*

CH001441
€47.12

DC IN USB Jack Encendido Audio Placa 820-3057-A Apple MacBook Air 13A1369 2011

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218S4PASA13G IXP450 SB450

218S4PASA13G IXP450 SB450

Part Number 218S4PASA13G Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 06+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000555
€11.93

218S4PASA13G IXP450 SB450

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