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  • Categories: BGA Reballing Kits, Stencils
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  • Categories: Multimeter, Test Tools

J5005 SR3S3 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000280
€14.92

J5005 SR3S3 Stencil Template 90*90

UNIT UT58D Modern Digital Multimeter AC DC Volt Amp Ohm Cap Inductance Tester

Description:

100% Brand New And High Quality

Display Count: 2000

Manual Range: v

Diode: v

Transistor: v

Auto Power Off: v

Continuity Buzzer: v

Data Hold: v

Low Battery Indication: v

Full Icon Display: v

Input Impedance for DCV: Around 10MO

Test Lead Connection Indications: v

Specifications:

Model: UT58D

DC Voltage (V): 200mV/20V/200V/1000V (0.5%+1)

AC Voltage (V): 2V/200V/1000V (0.8%+3

DC Current (A): 2mA/20mA/20A (0.8%+1)

AC Current (A): 2mA/20mA/20A (1%+3)

Resistance (O): 200O/2KO/200KO/2MO/20MO (0.8%+1)

Capacitance (F): 20nF/200nF/2F/100F (2.5%+5)

Inductance (H): 2mH/20mH/200mH/20H (2%+10)

General Characteristic:

Power: 9V Battery(6F22)(included)

LCD Size: 6.7 * 6.5cm

Product Color: Red and Grey

Product Net Weight: 350g (Including holster)

Product Size: 17.9 * 8.8 * 3.9cm / 7.4 * 3.5 * 1.6in

Package Weight: 577g / 1.3lb

Package includes:

1 x UNI-T UT58D Digital Multimeter

2 x Test Lead

1 x Muli-Purpose Socket

1 x English Manual

Because of the airspace controls not include battery

CH001567
€38.42

UNI-T UT58D Modern Digital Multimeter AC DC Volt Amp Ohm Cap Inductance Tester

2160833000 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000287
€5.40

216-0833000 Stencil Template

Foxconn Socket LGA2066 CPU Base PC Connector BGA Base

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000337
€17.65

Foxconn Socket LGA2066 CPU Base PC Connector BGA Base

N15EGTA2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000288
€7.46

N15E-GT-A2 Stencil Template

N17EESA1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000291
€7.46

N17E-ES-A1 Stencil Template

2160772003 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000299
€5.40

216-0772003 Stencil Template

J5005 SR3S3 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000280
€14.92

J5005 SR3S3 Stencil Template 90*90

UNIT UT58D Modern Digital Multimeter AC DC Volt Amp Ohm Cap Inductance Tester

Description:

100% Brand New And High Quality

Display Count: 2000

Manual Range: v

Diode: v

Transistor: v

Auto Power Off: v

Continuity Buzzer: v

Data Hold: v

Low Battery Indication: v

Full Icon Display: v

Input Impedance for DCV: Around 10MO

Test Lead Connection Indications: v

Specifications:

Model: UT58D

DC Voltage (V): 200mV/20V/200V/1000V (0.5%+1)

AC Voltage (V): 2V/200V/1000V (0.8%+3

DC Current (A): 2mA/20mA/20A (0.8%+1)

AC Current (A): 2mA/20mA/20A (1%+3)

Resistance (O): 200O/2KO/200KO/2MO/20MO (0.8%+1)

Capacitance (F): 20nF/200nF/2F/100F (2.5%+5)

Inductance (H): 2mH/20mH/200mH/20H (2%+10)

General Characteristic:

Power: 9V Battery(6F22)(included)

LCD Size: 6.7 * 6.5cm

Product Color: Red and Grey

Product Net Weight: 350g (Including holster)

Product Size: 17.9 * 8.8 * 3.9cm / 7.4 * 3.5 * 1.6in

Package Weight: 577g / 1.3lb

Package includes:

1 x UNI-T UT58D Digital Multimeter

2 x Test Lead

1 x Muli-Purpose Socket

1 x English Manual

Because of the airspace controls not include battery

CH001567
€38.42

UNI-T UT58D Modern Digital Multimeter AC DC Volt Amp Ohm Cap Inductance Tester

2160833000 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000287
€5.40

216-0833000 Stencil Template

Foxconn Socket LGA2066 CPU Base PC Connector BGA Base

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000337
€17.65

Foxconn Socket LGA2066 CPU Base PC Connector BGA Base

N15EGTA2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000288
€7.46

N15E-GT-A2 Stencil Template

N17EESA1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000291
€7.46

N17E-ES-A1 Stencil Template

2160772003 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000299
€5.40

216-0772003 Stencil Template