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  • Categories: Adapter, DC cable
  • Categories: Bios Chip Programming
  • Categories: CPU and Graphic Chips
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30m USB C Cable HiSpeed Type C to Type C Connector Data Cable

Powerful Backup Charge Cable:

As fast as your original USB-C cable. Best choice to backup for home, work or travel.

High Speed Syncing:

Transfer data from all your USB-C devices at speeds of up to 480 Mbps.

Reversible Connector:

USB-C's user-friendly design helps you plug and unplug easily without checking for the connector orientation.

High Quality:

CHOE usb type c cable with sturdy construction has connectors with molded strain relief for frequent unplugging and durability.

Popular USB C Cable Compatibility List:

For Apple(2015) new MacBook with 12" Retina Display

For 2015 Google Chromebook Pixel

For HP Pavilion x2

For Nokia N1

For Lenovo Zuk Z1

For Google Nexus 5X / 6P

For Google Pixel C

For Microsoft Lumia 950 / 950 XL

For ASUS Z580C tablet

And More

Specifications

Item: USB Type C Cable

Current Output: 5V 3A(Max)

Date Transfer: USB 2.0/480Mbps

Important Note:

1.Compatible with the USB Type-C port on the Apple USB-C Digital AV Multiport Adapter for charging only.

2.This cable is not compatible with OnePlus 2.

1 x USB Type C Cable

CH002778
kr118.11

3.0m USB C Cable Hi-Speed Type C to Type C Connector Data Cable

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A1419 EMC 3070 Bios Chip EFI Firmware 820-00609 Retina Mid2017 Core i5 I57600 MNEA2LLA

PO000002
kr216.22 kr270.27

A1419 EMC 3070 Bios EFI Firmware 820-00609 Retina Mid-2017 Core i5 I5-7600 MNEA2LL/A

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N14PGEOPA2

N14P-GE-OP-A2

Part Number N14P-GE-OP-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 13+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000486
kr501.77

N14P-GE-OP-A2

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G84950A2

G84-950-A2

Part Number G84-950-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1215

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000492
kr573.43

G84-950-A2

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Power supply 12V 3A 65x44

Power supply 12V 3A 6.5x4.4

Input Voltage Rang 100-240V Output DC 12V 3A

Connector Size 6.5mm*4.4mm Model Senes PPP009D

AC Cable Include AC Cable Description New

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002818
kr120.82

Power supply 12V 3A 6.5x4.4

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A1419 EMC 3070 Bios Chip EFI Firmware 820-00609 Retina Mid2017 Core i5 I57600K MNED2LLA

PO000003
kr216.22 kr270.27

A1419 EMC 3070 Bios EFI Firmware 820-00609 Retina Mid-2017 Core i5 I5-7600K MNED2LL/A

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2160810005 HD6750

216-0810005 HD6750

Part Number 216-0810005 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 17+

Package/Case 360 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000499
kr699.79

216-0810005 HD6750

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Power supply Sony 195V47A 65x44 90W

Power supply Sony 19.5V4.7A (6.5x4.4) 90W

Input Voltage Range AC 100V - 240V Output DC 19.5V4.7A

Connector Size 6.5mm*4.4mm Power 90W

AC Cable Include AC Cable Description New

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002962
kr128.97

Power supply Sony 19.5V4.7A (6.5x4.4) 90W

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A1419 EMC 3070 Bios Chip EFI Firmware 820-00609 Retina Mid2017 Core i7 I77700K BTOCTO

PO000004
kr216.22 kr270.27

A1419 EMC 3070 Bios EFI Firmware 820-00609 Retina Mid-2017 Core i7 I7-7700K BTO/CTO

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A1283 EMC 2264 Bios Chip EFI Firmware 820-2366 Early 2009 Core 2 Duo P7350 MB463LLA

PO000005
kr196.56 kr245.70

A1283 EMC 2264 Bios EFI Firmware 820-2366 Early 2009 Core 2 Duo P7350 MB463LL/A

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MCP77MVA2

MCP77MV-A2

Part Number MCP77MV-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 0932

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000508
kr284.57

MCP77MV-A2

30m USB C Cable HiSpeed Type C to Type C Connector Data Cable

Powerful Backup Charge Cable:

As fast as your original USB-C cable. Best choice to backup for home, work or travel.

High Speed Syncing:

Transfer data from all your USB-C devices at speeds of up to 480 Mbps.

Reversible Connector:

USB-C's user-friendly design helps you plug and unplug easily without checking for the connector orientation.

High Quality:

CHOE usb type c cable with sturdy construction has connectors with molded strain relief for frequent unplugging and durability.

Popular USB C Cable Compatibility List:

For Apple(2015) new MacBook with 12" Retina Display

For 2015 Google Chromebook Pixel

For HP Pavilion x2

For Nokia N1

For Lenovo Zuk Z1

For Google Nexus 5X / 6P

For Google Pixel C

For Microsoft Lumia 950 / 950 XL

For ASUS Z580C tablet

And More

Specifications

Item: USB Type C Cable

Current Output: 5V 3A(Max)

Date Transfer: USB 2.0/480Mbps

Important Note:

1.Compatible with the USB Type-C port on the Apple USB-C Digital AV Multiport Adapter for charging only.

2.This cable is not compatible with OnePlus 2.

1 x USB Type C Cable

CH002778
kr118.11

3.0m USB C Cable Hi-Speed Type C to Type C Connector Data Cable

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A1419 EMC 3070 Bios Chip EFI Firmware 820-00609 Retina Mid2017 Core i5 I57600 MNEA2LLA

PO000002
kr216.22 kr270.27

A1419 EMC 3070 Bios EFI Firmware 820-00609 Retina Mid-2017 Core i5 I5-7600 MNEA2LL/A

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N14PGEOPA2

N14P-GE-OP-A2

Part Number N14P-GE-OP-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 13+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000486
kr501.77

N14P-GE-OP-A2

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G84950A2

G84-950-A2

Part Number G84-950-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1215

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000492
kr573.43

G84-950-A2

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Power supply 12V 3A 65x44

Power supply 12V 3A 6.5x4.4

Input Voltage Rang 100-240V Output DC 12V 3A

Connector Size 6.5mm*4.4mm Model Senes PPP009D

AC Cable Include AC Cable Description New

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002818
kr120.82

Power supply 12V 3A 6.5x4.4

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A1419 EMC 3070 Bios Chip EFI Firmware 820-00609 Retina Mid2017 Core i5 I57600K MNED2LLA

PO000003
kr216.22 kr270.27

A1419 EMC 3070 Bios EFI Firmware 820-00609 Retina Mid-2017 Core i5 I5-7600K MNED2LL/A

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2160810005 HD6750

216-0810005 HD6750

Part Number 216-0810005 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 17+

Package/Case 360 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000499
kr699.79

216-0810005 HD6750

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Power supply Sony 195V47A 65x44 90W

Power supply Sony 19.5V4.7A (6.5x4.4) 90W

Input Voltage Range AC 100V - 240V Output DC 19.5V4.7A

Connector Size 6.5mm*4.4mm Power 90W

AC Cable Include AC Cable Description New

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002962
kr128.97

Power supply Sony 19.5V4.7A (6.5x4.4) 90W

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  • -20%

A1419 EMC 3070 Bios Chip EFI Firmware 820-00609 Retina Mid2017 Core i7 I77700K BTOCTO

PO000004
kr216.22 kr270.27

A1419 EMC 3070 Bios EFI Firmware 820-00609 Retina Mid-2017 Core i7 I7-7700K BTO/CTO

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  • -20%

A1283 EMC 2264 Bios Chip EFI Firmware 820-2366 Early 2009 Core 2 Duo P7350 MB463LLA

PO000005
kr196.56 kr245.70

A1283 EMC 2264 Bios EFI Firmware 820-2366 Early 2009 Core 2 Duo P7350 MB463LL/A

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MCP77MVA2

MCP77MV-A2

Part Number MCP77MV-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 0932

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000508
kr284.57

MCP77MV-A2

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