• Show Sidebar

There are 862 products.

Active filters

  • Categories: CPU and Graphic Chips
  • Categories: Programmer & Sockets
  • Categories: Programmer socket
  • Availability: In stock
wishlist
Compare
Quickview

N11PGS2A2

N11P-GS2-A2

Part Number N11P-GS2-A2 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 1023

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000623
€41.03

N11P-GS2-A2

wishlist
Compare
Quickview

SR2KL N3710

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000639
€57.44

SR2KL N3710

wishlist
Compare
Quickview

GFGO7200TNA3

GF-GO7200T-N-A3

Part Number GF-GO7200T-N-A3 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 0952

Package/Case 600 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000644
€32.00

GF-GO7200T-N-A3

wishlist
Compare
Quickview

Orange5 Professional Programming Device With Full Packet Hardware

Orange5 Professional Programming Device With Basic Module Get Four Additional Software Free

Login to Download: * Configure

List of Special Functions

Chip Support List

Software Version: V1.34, Software Does not Support Update.

Language: English and Russian

Systems: XP WIN7 WIN8

Additional Supported Software:

Immo HPX 9V0

NEC V850ES/SJ3 V850ES/SG3 UART

NEC V850E2 NEW

Software Licenses:

MTRK (Included in Orange-5 base)

TMS (Included in Orange-5 base)

M08V NEW

Immo HPX 9V0

NEC V850ES/SJ3 V850ES/SG3 UART

NEC V850E2 NEW

Orange5 Technical Info:

* USB power supply (USB2.0/3.0)

* Universal easy to plug panel ZIF16 for EEPROM

* Control of contacts in the sockets

* Two expansions compatible with Orange4 and Omega MTRK

* Protection against overcurrent

* Overload voltage protection

* Two types of power supply: Standart (USB) and enhanced (USB + external power supply)

* Three 3 adjustable voltage and current control: Voltage of power supply ( 2.0...5.0V ), programming voltage (2.0...21.0V), additional static 10V for microcontrollers

* High-speed bidirectional pin drivers with adjustable voltage (2.0...5.0V)

* Wave cycle generator with frequency ( up to 24 Mhz) and out voltage(2.0...5.0V) adjustment

* Capability of functional emulation of class CDC USB devices

* Built-in 32-bit virtual machine

* Supported interface: I2C, SPI, MicroWire, JTAG, UART, BDM, ISO7816, K-LINE (via adapter), CAN (via adapter)

* Programmer is encolsed in a functional box. Supported working under Windows XP/7 32bit. [*Win8.1]

- Installation and Work with Orange-5 under Windwos 7 and Windows 8.1

CnCterm - Terminal program for work with COM ports.

Feature:

Supports any COM ports, incuding virtual ones from 1 to 20

Works with text (ASCII) and HEX mode

Creating a list of commands that allows editing and fast sending

Fine-tuning the exchange rate

Saving files including command and port settings.

Saving incoming data in binary files

File transfer via serial port.

Delay settings for bytes and blocks

"Echo" mode

Delay settings between incoming data

Managment of DTR, RTS chains, visualising DSR, CTS, CD, RI

Program doesn't need to be installed

Supports Orange5 programmer in emulation mode.

CH000806
€108.16

Orange5 Professional Programming Device With Full Packet Hardware

wishlist
Compare
Quickview

G84751A2 8700MGT

G84-751-A2 8700MGT

Part Number G84-751-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1215

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000660
€49.23

G84-751-A2 8700MGT

wishlist
Compare
Quickview

N17SLGA1

N17S-LG-A1

Part Number N17S-LG-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 17+

Package/Case 1 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000678
€49.03

N17S-LG-A1

wishlist
Compare
Quickview

N13PGVSA2

N13P-GV-S-A2

Part Number N13P-GV-S-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 12+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000683
€15.72

N13P-GV-S-A2

wishlist
Compare
Quickview

2160729051 HD4670

216-0729051 HD4670

Part Number 216-0729051 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 10+

Package/Case 360 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000692
€51.51

216-0729051 HD4670

N11PGS2A2

N11P-GS2-A2

Part Number N11P-GS2-A2 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 1023

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000623
€41.03

N11P-GS2-A2

wishlist
Compare

SR2KL N3710

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000639
€57.44

SR2KL N3710

wishlist
Compare

GFGO7200TNA3

GF-GO7200T-N-A3

Part Number GF-GO7200T-N-A3 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 0952

Package/Case 600 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000644
€32.00

GF-GO7200T-N-A3

wishlist
Compare

Orange5 Professional Programming Device With Full Packet Hardware

Orange5 Professional Programming Device With Basic Module Get Four Additional Software Free

Login to Download: * Configure

List of Special Functions

Chip Support List

Software Version: V1.34, Software Does not Support Update.

Language: English and Russian

Systems: XP WIN7 WIN8

Additional Supported Software:

Immo HPX 9V0

NEC V850ES/SJ3 V850ES/SG3 UART

NEC V850E2 NEW

Software Licenses:

MTRK (Included in Orange-5 base)

TMS (Included in Orange-5 base)

M08V NEW

Immo HPX 9V0

NEC V850ES/SJ3 V850ES/SG3 UART

NEC V850E2 NEW

Orange5 Technical Info:

* USB power supply (USB2.0/3.0)

* Universal easy to plug panel ZIF16 for EEPROM

* Control of contacts in the sockets

* Two expansions compatible with Orange4 and Omega MTRK

* Protection against overcurrent

* Overload voltage protection

* Two types of power supply: Standart (USB) and enhanced (USB + external power supply)

* Three 3 adjustable voltage and current control: Voltage of power supply ( 2.0...5.0V ), programming voltage (2.0...21.0V), additional static 10V for microcontrollers

* High-speed bidirectional pin drivers with adjustable voltage (2.0...5.0V)

* Wave cycle generator with frequency ( up to 24 Mhz) and out voltage(2.0...5.0V) adjustment

* Capability of functional emulation of class CDC USB devices

* Built-in 32-bit virtual machine

* Supported interface: I2C, SPI, MicroWire, JTAG, UART, BDM, ISO7816, K-LINE (via adapter), CAN (via adapter)

* Programmer is encolsed in a functional box. Supported working under Windows XP/7 32bit. [*Win8.1]

- Installation and Work with Orange-5 under Windwos 7 and Windows 8.1

CnCterm - Terminal program for work with COM ports.

Feature:

Supports any COM ports, incuding virtual ones from 1 to 20

Works with text (ASCII) and HEX mode

Creating a list of commands that allows editing and fast sending

Fine-tuning the exchange rate

Saving files including command and port settings.

Saving incoming data in binary files

File transfer via serial port.

Delay settings for bytes and blocks

"Echo" mode

Delay settings between incoming data

Managment of DTR, RTS chains, visualising DSR, CTS, CD, RI

Program doesn't need to be installed

Supports Orange5 programmer in emulation mode.

CH000806
€108.16

Orange5 Professional Programming Device With Full Packet Hardware

wishlist
Compare

G84751A2 8700MGT

G84-751-A2 8700MGT

Part Number G84-751-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1215

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000660
€49.23

G84-751-A2 8700MGT

wishlist
Compare

N17SLGA1

N17S-LG-A1

Part Number N17S-LG-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 17+

Package/Case 1 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000678
€49.03

N17S-LG-A1

wishlist
Compare

N13PGVSA2

N13P-GV-S-A2

Part Number N13P-GV-S-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 12+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000683
€15.72

N13P-GV-S-A2

wishlist
Compare

2160729051 HD4670

216-0729051 HD4670

Part Number 216-0729051 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 10+

Package/Case 360 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000692
€51.51

216-0729051 HD4670

wishlist
Compare
Back to top