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Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

GK208-302-B1

Part Number GK208-302-B1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1606

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

In package included:

 1 pcs Programmer SVOD Ver. 4

 1 pcs USB Connection cable

 1 pcs Extended board LVDS, EDP

 1 pcs EFI Ribbon Cable ( Hirose12+Hirose30 + Molex30 )

 1 pcs Extended board of ports for keyboard module

 12pcs Flex cables: 34pin, 32pin, 30pin, 26pin (all cables what you see in picture).

Please to select shipping option in checkout:

Economy: 10-35 working days (Europe and Worldwide)

Expedited : 5-10 working days  (Europe and Worldwide)

SVOD V4 programmer  is a universal programmer for various microcircuits.

 As you know you can program different kinds of chips such as:  SPI, I2C, ONE WIRE, NAND, NAND SPI, NOR, EMMC, JTAG, UART, ENE, MEC, ITE, NUVOTON, parallel synchronous and asynchronous protocols. Automatic detection of "bad contact" when connecting chips.

Protocol: JEDEC ID (spi25 flash, Nand have 5 byte ID, spi NAND have 512 byte ID, nor48,40 have 3 byte id, emmc have 512 byte id, new spi25 have id with 128 byte info).

 Specifications:

*SVOD 4 port of connection to the computer: usb 2.0- 3.0 high speed,

*SVOD 4 CPU: Processor ARM7, 480MHz

*SVOD 4 Voltage: 12V, 5V, 3.3V, 2.5V, 1.8V, 1.5V, 1.25V, 1.2V, 0.8V

*SVOD 4 GPIO PIN: 48+16 

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As you know you can program different kinds of chips such as:  SPI, I2C, ONE WIRE, NAND, NAND SPI, NOR, EMMC BGA, JTAG, UART, ENE, MEC, ITE, NUVOTON, parallel synchronous and asynchronous protocols. Automatic detection of "bad contact" when connecting chips.

Supported:

KB9010,KB9012, KB9016, KB9018, KB9022, KB9028qc

NPCE288N/NPCE388N

ITE IT5571VG PROGRAMMABLE

ITE IT8380E PROGRAMMABLE

ITE IT8380VG PROGRAMMABLE

ITE IT8386 PROGRAMMABLE

ITE IT8522 PROGRAMMABLE

ITE IT8580 PROGRAMMABLE

ITE IT8585E PROGRAMMABLE

ITE IT8586E PROGRAMMABLE

ITE IT8586VG PROGRAMMABLE

ITE IT8587E PROGRAMMABLE

ITE IT8589 PROGRAMMABLE

ITE IT8886H PROGRAMMABLE

ITE IT8886HE PROGRAMMABLE

ITE IT8985E PROGRAMMABLE

ITE IT8987E PROGRAMMABLE

ITE IT8995E PROGRAMMABLE

NUVOTON NPCE288NA0DX PROGRAMMABLE

NUVOTON NPCE388NA0DX PROGRAMMABLE

LENOVO IT8227VGPROGRAMMABLE

MEC1404-NU 128-VTQFP PROGRAMMABLE 128 KB

SMSC MEC1404-SZ 144-WFBGA PROGRAMMABLE 128 KB

SMSC MEC1406-NU 128-VTQFP PROGRAMMABLE 160 KB

SMSC MEC1406-SZ 144-WFBGA PROGRAMMABLE 160 KB

SMSC MEC1408-NU 128-VTQFP PROGRAMMABLE 192 KB

SMSC MEC1408-SZ 144-WFBGA PROGRAMMABLE 192 KB

SMSC MEC1414-NU 128-VTQFP PROGRAMMABLE 128 KB

SMSC MEC1414-SZ 144-WFBGA PROGRAMMABLE 128 KB

SMSC MEC1416-NU 128-VTQFP PROGRAMMABLE 160 KB

SMSC MEC1416-SZ 144-WFBGA PROGRAMMABLE 160 KB

SMSC MEC1418-NU 128-VTQFP PROGRAMMABLE 192 KB

SMSC MEC1418-SZ 144-WFBGA PROGRAMMABLE 192 KB

SMSC MEC1609 PROGRAMMABLE

SMSC MEC1619 PROGRAMMABLE

SMSC MEC1632 PROGRAMMABLE

SMSC MEC1633 PROGRAMMABLE

SMSC MEC1641 PROGRAMMABLE

SMSC MEC1650 PROGRAMMABLE

SMSC MEC1651 PROGRAMMABLE

SMSC MEC1653 PROGRAMMABLE

SMSC MEC5035 PROGRAMMABLE

SMSC MEC5045 PROGRAMMABLE

SMSC MEC5055 PROGRAMMABLE

SMSC MEC5075 PROGRAMMABLE

SMSC MEC5085 PROGRAMMABLE

SMSC MEC1609 PROGRAMMABLE

 SMSC MEC1609I PROGRAMMABLE

SMSC MEC1633L PROGRAMMABLE

 EPF011/021/035/036/037

 SMSC MEC5085 NON-PROGRAMMABLE

 You can buy a brand new programmer / Tested 100% .

The mode of displaying POST codes of the laptop motherboard is implemented. Choose the software in the online base of your motherboard, download, select it in the choice of motherboard, connect the motherboard with a loop to the keyboard connector, and read the post codes by running the software in read mode of POST codes.

MANY FLASHING FILES IN DATABASE FOR FREE WHEN YOU WILL CONNECT PROGRAMMER

if you are not from Europe, please inquire about customs tax, VAT of your country.

We send products in Russia via registered POST (12-20 days).

Colombia, Paraguay, Brazil, Mexico - before placing an order, please to ask your customs about tax and duties.

Colombia, Paraguay, Brazil, Mexico - antes de realizar un pedido, consulte con la aduana sobre la cantidad de impuestos y aranceles.

Si no eres de Europa, consulta sobre el impuesto de aduanas, el IVA de tu país.

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

216-0857001

Part Number 216-0857001 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 14+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

N3150 SR29F Stencil Template

Part Number intel CPU Stencil Manufacturer ATK

Stencil Template Direct heating Metal 304 Stainless steel

Package/Case 1 PCS Description Buik new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

N12P-LP-A1 GT540M

Part Number N12P-LP-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1341

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

EM1200GBB22GV E1-1200

Part Number EM1200GBB22GV Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 13+

Package/Case 360 Description Original new

EM1200GBB22GV E1-1200 Processor for Laptop AMD E1 BGA413 1.4 GHz CPU

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

N15E-GX-A2 Stencil Template 90*90

DH82Z97 SR1JJ

Part Number DH82Z97 SR1JJ Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

GF104-325-A1 Stencil Template

GL82HM175 SR30W

Part Number GL82HM175 SR30W Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 15+

Package/Case 1 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock