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• Product: Yellow LEDs
• Mounting Style: SMD/SMT
• Package/Case: PLCC-6
• Illumination Colour: Yellow
• Wavelength/Colour Temperature: 590 nm
• Luminous Intensity: 2.8 cd
• Luminous Flux/Radiant Flux: 9.5 lm
• Lens Colour/Style: Water Clear
• If - Forward Current: 140 mA
• Vf - Forward Voltage: 2.2 V
• Power Rating: 1 W
• Length: 3.2 mm
• Width: 3 mm
• Height: 1.9 mm
• Minimum Operating Temperature: - 40 C
• Maximum Operating Temperature: + 110 C
• Series: Advanced Power TOPLED
• Brand: OSRAM Opto Semiconductors
• LED Size: 3.2 mm x 3 mm x 1.9 mm
• Lens Shape: Round Flat
• Viewing Angle: 120 deg

In package included:

1 pcs x GZUT EZP XPRO Programmer

1 pcs x EFI Riboon Cable

2 pcs x small PCB

1 pcs x USB cable

You can select shipping option in checkout:  Economy or Expedited

Economy: 10-35 working days (Europe and Worldwide)

Expedited : 5-10 working days  (Europe and Worldwide)

 With this Professional SET you can make adjustments for Bios manually and fix EFI.

This flashing set (GZUT v2 PRO + EFI RIBBON CABLE) used for Mcbook, McBook Air and new McBook Pro models from 2010 to 2017 

It has three connectors for the years 2010 – 2011, 2012 – 2014 and 2015 – 2017

You can read bios chip without desoldering process. 

Programmer EZP GZUT v2 PRO set supported  :

MBA11 2015 A1465 820-00164
MBA11 2013 A1465 820-3435
MBA13 2011 A1369 820-3023
MBA11 2011 A1370 820-3024
MBA 13 2013 A1466 820-3437
MBA 13 2012 A1466 820-3209
MBA13 2015 A1466 820-00165
MBA13 2017 A1466 820-00165
MBP13 2016 A1708 820-00875
MBP13 2016 A1706 820-00239
MBP15 2017 A1707 820-00928
MBP15 2016 A1707 820-00281
MBP13 2017 A1706 820-00923
MBP13 2017 A1708 820-00840
MBP13 2015 A1502 820-4924
MBP13 2014 A1502 820-3476
MBP13 2014 A1502 820-3536 
MBP13 2013 A1502 820-3476
MBP13 2014 A1502 820-3476
MBP15 2012 A1398 820-3332
MBP15 2013 A1398 820-3332
MBP15 2013 A1398 820-3662
MBP15 2013 A1398 820-3787
MBP15 2014 A1398 820-3662
MBP15 2015 A1398 820-00138 
MBP15 2015 A1398 820-00163
MBP12 2015 A1534 820-00045
MBP12 2016 A1534 820-00244
MacMini 2011 A1347 820-2993

Apple Macbook Pro A1286 M98_820-2330-A_G96-632-C1_SST25VF032B - EFI ribbon cable not compatible, support GOLDEN pin silicone cable. 

You can used GOLD PIN SILICONE CABLE and read this bios chip (visit our shop and check)

Apple A1278 K6 MCP89MZ-A2 SST25VF032B -  EFI ribbon cable not compatible (support only GOLDEN PIN silicone cable)

Apple Imac 27 A1312 820-2828-A_MX25L6406E - EFI ribbon cable not compatible (support only GOLDEN PIN silicone cable)

Apple MacBook Pro A1297 820-2914-B-MX25L6406E - EFI ribbon cable not compatible (support only GOLDEN PIN silicone cable)

Apple MacBook Pro A1278-820-2936-B-MXIC MX25L6406E - EFI ribbon cable not compatible (support only GOLDEN PIN silicone cable)

Apple MacBook Pro 13" A1278 820-3115-B MD101 MX25L6406E  - EFI ribbon cable not compatible (support only GOLDEN PIN silicone cable)

In our store also you can find and Chips Cards: 

If you are not from Europe, please inquire about customs tax, VAT of your country.

We do not ship products to Australia with economy Post, only Express.

We do not ship any products to Russia.

Counties: Colombia, Paraguay, Brazil, Mexico, India, UK, Canada and ect - before placing an order, please to ask your customs about tax and duties.

Counties: Colombia, Paraguay, Brazil, Mexico, India, UK, Canada and ect  - antes de realizar un pedido, consulte con la aduana sobre la cantidad de impuestos y aranceles.

Si no eres de Europa, consulta sobre el impuesto de aduanas, el IVA de tu país.

250K PMTC 0.45mm BGA No Pb/Lead Free Solder Balls

Part Number 0.45mm BGA Solder Balls Manufacturer PMTC

BGA Alloy Sn96.5/Ag3/Cu0.5 Date Code 19+

Package/Case 250K Description Brand New

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Reballing Soldering Flux Injection Putter

MECHANIC T7000 50ML Multi-purpose adhesive

25K Qwin 0.40mm BGA Leaded Solder Balls

Part Number 0.40mm BGA Leaded Solder Balls Manufacturer Qwin

BGA Alloy Sn63/Pb37 Date Code 19+

Package/Case 25K Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

250K PMTC 0.55mm BGA No Pb/Lead Free Solder Balls

Part Number 0.55mm BGA Solder Balls Manufacturer PMTC

BGA Alloy Sn96.5/Ag3/Cu0.5 Date Code 19+

Package/Case 250K Description Brand New

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

250K PMTC 0.35mm BGA No Pb/Lead Free Solder Balls

Part Number 0.35mm BGA Solder Balls Manufacturer PMTC

BGA Alloy No Pb/Lead Free Date Code 19+

Package/Case 250K Description Brand New

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

HDD Open repair&data recovery tool: * Use Tutorials Video

HD HPE PRO: A Must-Have hardware level of disk repair and data recovery equipment, which enables you an easy and exact drive disassembling and HEAD stack/Platter exchange.

Main Features: Easy to use; Universal-fit workbench; Pioneer platter exchanger; change multiple platters without moving the platters out of alignment with each other; Special Actuator Remover with strong magnetism works (removal, installation) easily on the upper magnet of the actuator.

Highlights:

Universal-fit workbench assures you to operate on your HD on a relatively stable table, making your job easier and more reliable.

Pioneer platter exchanger maintains the original cylinder status by removing and placing each platter of the multiple platters together, so that allows you to change multiple platters without moving the platters out of alignment with each other which otherwise will result in data corruption.

Special Actuator Remover assures you to perform easy operation (removal, installation) on the upper magnet of the actuator which is very hard to be removed and put back because of its strong magnetism and it's sensitive and embarrassed position (being very close to both the Head Stack and Media Platter), in case it slips out and touch either of its fragile neighbors during the operations - the consequences will be a disaster.

Packing List:

1.Universal-fit Workbench -1pc;

2.Multiple Platter Exchanger -4pcs;

3.Stable Actuator Exchanger -1pc;

4.Replacement tools for 2.5 inch disk -1pc

5.Replacement tools for 3.5 inch disk -1pc

6.Tool 96pcs kits