EME300GBB22GV E-300
Part Number EME300GBB22GV Manufacturer AMD
BGA Alloy No Pb/Lead Free Date Code 11+
Package/Case 360 Description Original new
EME300GBB22GV E-300 Processor AMD Mobile CPU BGA413 1.3 GHz Cores2
Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
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CH001891
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EME300GBB22GV E-300
