Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
CH001169
No customer reviews for the moment.
16 other products in the same category
BGA96 U3100 CD3215A CD3215C00 CD3215B01 CD3215B03 74ABJLW Stencil Template
Brands: Chipsetpro.com
€9.70
BGA96 U3100 CD3215A CD3215C00 CD3215B01 CD3215B03 74ABJLW Stencil Template
i76820HK SR2FL Stencil Template 90x90
Brands: Chipsetpro.com
€9.50
i7-6820HK SR2FL Stencil Template 90*90
BD82C608 SLJKF Stencil Template 90x90
Brands: Chipsetpro.com
€17.14
BD82C608 SLJKF Stencil Template 90*90
BD82X79 SLJHW Stencil Template 90x90
Brands: Chipsetpro.com
€9.96
BD82X79 SLJHW Stencil Template 90*90
i7-6920HQ SR2FT Stencil Template 90*90
