Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
CH001748
No customer reviews for the moment.
16 other products in the same category
6in1 Stencil Template BGA153 162 169 186 221 254 EMCP EMMC
Brands: Chipsetpro.com
€9.82
6in1 Stencil Template BGA153 /162 /169 /186 /221 /254 EMCP EMMC
EMMCEMCPUFSFont BGA153162169186221254 Stencil Solder Station Kits
Brands: Chipsetpro.com
€47.12
EMMC/EMCP/UFS/Font BGA153/162/169/186/221/254 Stencil Solder Station Kits
i5-7200U SR2ZU Stencil Template
