Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
CH000209
No customer reviews for the moment.
16 other products in the same category
i74702HQ SR15F Stencil Template 90x90
Brands: Chipsetpro.com
€9.94
i7-4702HQ SR15F Stencil Template 90*90
FH82CM246 SR40E Stencil Template 90x90
Brands: Chipsetpro.com
€9.95
FH82CM246 SR40E Stencil Template 90*90
i76920HQ SR2FT Stencil Template 90x90
Brands: Chipsetpro.com
€20.11
i7-6920HQ SR2FT Stencil Template 90*90
BGA178 LPDDR3 H9CCNNNBJTAL H9CCNNNBLTAL FA232A1MA Stencil Template
Brands: Chipsetpro.com
€5.59
BGA178 LPDDR3 H9CCNNNBJTAL H9CCNNNBLTAL FA232A1MA Stencil Template
i5-2520M SR04A Stencil Template
