Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
CH002071
No customer reviews for the moment.
16 other products in the same category
i56198DU SR2NR Stencil Template 90x90
Brands: Chipsetpro.com
€9.96
i5-6198DU SR2NR Stencil Template 90*90
i32375M SR0U4 Stencil Template 90x90
Brands: Chipsetpro.com
€17.14
i3-2375M SR0U4 Stencil Template 90*90
SRCKB SRCUU SRD1V SREJP SREJQ SREJR SRF6X SRFFX SRFFZ SRGKW 8265U 8565U Stencil Template
Brands: Chipsetpro.com
€20.89
SRCKB SRCUU SRD1V SREJP SREJQ SREJR SRF6X SRFFX SRFFZ SRGKW 8265U 8565U Stencil Template
i5-6200U SR2EY Stencil Template 90*90
