Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
CH002250
No customer reviews for the moment.
16 other products in the same category
i56198DU SR2NR Stencil Template 90x90
Brands: Chipsetpro.com
€9.96
i5-6198DU SR2NR Stencil Template 90*90
i52450M SR06Z Stencil Template 90x90
Brands: Chipsetpro.com
€9.96
i5-2450M SR06Z Stencil Template 90*90
i52435M SR06Y Stencil Template 90x90
Brands: Chipsetpro.com
€9.97
i5-2435M SR06Y Stencil Template 90*90
FM880PAAY43KA Stencil Template 90x90
Brands: Chipsetpro.com
€9.97
FM880PAAY43KA Stencil Template 90*90
i54200U SR170 Stencil Template 90x90
Brands: Chipsetpro.com
€9.96
i5-4200U SR170 Stencil Template 90*90
BGA96 U3100 CD3215A CD3215C00 CD3215B01 CD3215B03 74ABJLW Stencil Template
