Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
CH002628
No customer reviews for the moment.
16 other products in the same category
AM950BADY23AB Stencil Template 90x90
Brands: Chipsetpro.com
€9.97
AM950BADY23AB Stencil Template 90*90
SONY PS3 D5305AFK RSX D5305F Stencil Template
Brands: Chipsetpro.com
€5.40
SONY PS3 D5305AFK RSX D5305F Stencil Template
i76600U SR2F1 Stencil Template 90x90
Brands: Chipsetpro.com
€17.14
i7-6600U SR2F1 Stencil Template 90*90
SR177 SR1JJ SR173 SR175 SR176 SR178 SR179 Stencil Template 90x90
Brands: Chipsetpro.com
€9.96
SR177 SR1JJ SR173 SR175 SR176 SR178 SR179 Stencil Template 90*90
FNP102B1E01 FNP102B1E31 Stencil Template
Brands: Chipsetpro.com
€8.58
FNP102-B1E01 FNP102-B1E31 Stencil Template
i56260U SR2JC Stencil Template 90x90
Brands: Chipsetpro.com
€9.96
i5-6260U SR2JC Stencil Template 90*90
i56198DU SR2NR Stencil Template 90x90
Brands: Chipsetpro.com
€9.96
i5-6198DU SR2NR Stencil Template 90*90
i3-2365M SR0U3 Stencil Template 90*90
