Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
CH002628
No customer reviews for the moment.
16 other products in the same category
i76600U SR2F1 Stencil Template 90x90
Brands: Chipsetpro.com
€17.14
i7-6600U SR2F1 Stencil Template 90*90
GL82B150 SR2C7 Stencil Template 90x90
Brands: Chipsetpro.com
€17.14
GL82B150 SR2C7 Stencil Template 90*90
AM5000IBJ44HM AM5200IAJ44HM AMD Stencil Template
Brands: Chipsetpro.com
€5.40
AM5000IBJ44HM AM5200IAJ44HM AMD Stencil Template
BD82HM76 SLJ8E Stencil Template 90x90
Brands: Chipsetpro.com
€9.96
BD82HM76 SLJ8E Stencil Template 90*90
AM870PAAY43KA Stencil Template 90x90
Brands: Chipsetpro.com
€17.14
AM870PAAY43KA Stencil Template 90*90
i3-2365M SR0U3 Stencil Template 90*90
