BD82QM67 SLJ4M Stencil Template 90x90
BD82QM67 SLJ4M Stencil Template 90*90
Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
No customer reviews for the moment.
BD82QM67 SLJ4M Stencil Template 90*90
IT8586VG IT8587VG IT8517VG IT8585VG IT8518VG IT8528VG Stencil Template
AM950BADY23AB Stencil Template 90*90
SR17E SR17C SR17D SR13J SR13H DH82HM86 DH82HM87 Stencil Template
F2117LP-20H DF2117RVPLP20HV Stencil Template