Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
CH003585
No customer reviews for the moment.
16 other products in the same category
i34030U SR1EN Stencil Template 90x90
Brands: Chipsetpro.com
€17.14
i3-4030U SR1EN Stencil Template 90*90
BD82HM70 SJTNV Stencil Template 90x90
Brands: Chipsetpro.com
€9.96
BD82HM70 SJTNV Stencil Template 90*90
THGBM4G4D1HBA1R BGA153 Stencil Template
Brands: Chipsetpro.com
€6.22
THGBM4G4D1HBA1R BGA153 Stencil Template
Universal Stencil Template 27pcs 90x90mm
Brands: Chipsetpro.com
€38.00
Universal 27pcs 90mm*90mm Stencil Template
i5-6440EQ SR2DU Stencil Template 90*90
