Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
CH003666
No customer reviews for the moment.
16 other products in the same category
i32377M SR0CW Stencil Template 90x90
Brands: Chipsetpro.com
€9.96
i3-2377M SR0CW Stencil Template 90*90
i57440EQ SR34T Stencil Template 90x90
Brands: Chipsetpro.com
€9.50
i5-7440EQ SR34T Stencil Template 90*90
LGE2111T8 LGE2111AT8 Stencil Template
Brands: Chipsetpro.com
€8.58
LGE2111-T8 LGE2111A-T8 Stencil Template
GF-GO7600T-N-B1 Stencil Template
