Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
CH000398
No customer reviews for the moment.
16 other products in the same category
i52415M SR071 Stencil Template 90x90
Brands: Chipsetpro.com
£8.52
i5-2415M SR071 Stencil Template 90*90
AM870PAAY43KA Stencil Template 90x90
Brands: Chipsetpro.com
£14.67
AM870PAAY43KA Stencil Template 90*90
FH82HM370 SR40B Stencil Template 90x90
Brands: Chipsetpro.com
£8.51
FH82HM370 SR40B Stencil Template 90*90
Pentium DualCore Mobile 987 SR0V4 Stencil Template
Brands: Chipsetpro.com
£4.62
Pentium Dual-Core Mobile 987 SR0V4 Stencil Template
SR0FB Pentium DualCore Mobile Stencil Template 90x90
Brands: Chipsetpro.com
£14.67
SR0FB Pentium Dual-Core Mobile Stencil Template 90*90
BD82X79 SLJN7 Stencil Template 90x90
Brands: Chipsetpro.com
£8.52
BD82X79 SLJN7 Stencil Template 90*90
BD82Q67 SLJ4D Stencil Template
