Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
CH004000
No customer reviews for the moment.
16 other products in the same category
SR2NH H67388 Stencil Solder Station Kits
Brands: Chipsetpro.com
€36.67
SR2NH H67388 Stencil Solder Station Kits
i32375M SR0U4 Stencil Template 90x90
Brands: Chipsetpro.com
€17.14
i3-2375M SR0U4 Stencil Template 90*90
i33110M QC4U Stencil Template 90x90
Brands: Chipsetpro.com
€9.96
i3-3110M QC4U Stencil Template 90*90
BD82QS67 SLJ4K Stencil Template
