Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
CH004418
No customer reviews for the moment.
16 other products in the same category
BD82HM67 SLJ4N Stencil Template 90x90
Brands: Chipsetpro.com
€17.14
BD82HM67 SLJ4N Stencil Template 90*90
i56300HQ SR2SK Stencil Template 90x90
Brands: Chipsetpro.com
€9.50
i5-6300HQ SR2SK Stencil Template 90*90
E31535M SR2FM Stencil Template 90x90
Brands: Chipsetpro.com
€20.11
E3-1535M SR2FM Stencil Template 90*90
980 YFE TM4EA23I H6ZXRI TM4EA23IH6ZXRI Stencil Template
