N16EGSKABA1 Stencil Template 90x90
N16E-GS-KAB-A1 Stencil Template 90*90
Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
No customer reviews for the moment.
N16E-GS-KAB-A1 Stencil Template 90*90
Pentium Dual-Core Mobile SR0FB Stencil Template
A1707 A1706 339S00056 SR2NH SR27N H67388 SN650839 Stencil Template
4in1 Stencil Template LGA52 LGA60 LGA70 NAND Stencil Template PCIE Stencil Template
i5-6198DU SR2NR Stencil Template 90*90
i5-2540M SR046 Stencil Template 90*90