Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
CH004476
No customer reviews for the moment.
16 other products in the same category
i33110M QC4V Stencil Template 90x90
Brands: Chipsetpro.com
€9.96
i3-3110M QC4V Stencil Template 90*90
BD82HM77 SLJ8C Stencil Template 90x90
Brands: Chipsetpro.com
€17.14
BD82HM77 SLJ8C Stencil Template 90*90
Stencil Holder Reballing Station BGA Solder Station With Magnet90x90
Brands: Chipsetpro.com
€65.00
ZQT-90X BGA Reballing Station 80*80 90*90 Stencils Reballing Station BGA Solder Station
SR0FB Pentium DualCore Mobile Stencil Template 90x90
Brands: Chipsetpro.com
€17.14
SR0FB Pentium Dual-Core Mobile Stencil Template 90*90
BD82X79 SLJN7 Stencil Template 90x90
Brands: Chipsetpro.com
€9.96
BD82X79 SLJN7 Stencil Template 90*90
G86-304-A2 Stencil Template
