Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
No customer reviews for the moment.
YM2200C4T20FB YM2300C4T4MFB YM2500C4T4MFB YM2700C4T4MFB Stencil Template
BD82X79 SLJN7 Stencil Template 90*90
i5-3317U SR0N8 Stencil Template 90*90
GL82H110 SR2CA Stencil Template 90*90
216-0774009 Stencil Template
