
GK104425A2 Stencil Template 90x90
GK104-425-A2 Stencil Template 90*90
Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
No customer reviews for the moment.
GK104-425-A2 Stencil Template 90*90
i7-7700HQ SR32Q Stencil Template 90*90
i5-4200U SR170 Stencil Template 90*90
SAK-TC1797 SAK-TC1796 MPC5566 Stencil Template 90*90
i3-2370M SR0DR Stencil Template 90*90
Pentium Dual-Core Mobile SR0V5 Stencil Template