Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
CH004704
No customer reviews for the moment.
16 other products in the same category
BD82HM70 SJTNV Stencil Template 90x90
Brands: Chipsetpro.com
€9.96
BD82HM70 SJTNV Stencil Template 90*90
BCM4709 BCM4709C0KFEBG BCM4709A0KFEBG Stencil Template 90x90
Brands: Chipsetpro.com
€13.18
BCM4709 BCM4709C0KFEBG BCM4709A0KFEBG Stencil Template 90*90
BGA153 BGA169 Stencil Template 90x90
Brands: Chipsetpro.com
€12.40
BGA153 BGA169 Stencil Template 90*90
i52467M SR0D6 Stencil Template 90x90
Brands: Chipsetpro.com
€17.14
i5-2467M SR0D6 Stencil Template 90*90
Samsung Exynos9820SM8150S10S10NITE10 Stencil Template
Brands: Chipsetpro.com
€8.58
Samsung Exynos9820/SM8150/S10/S10+/NITE10 Stencil Template
FH82HM370 SR40B Stencil Template 90x90
Brands: Chipsetpro.com
€9.95
FH82HM370 SR40B Stencil Template 90*90
G73-N-B1 Stencil Template
