Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
CH004711
No customer reviews for the moment.
16 other products in the same category
V537A426SR2FQ Stencil Template 90x90
Brands: Chipsetpro.com
€20.11
V537A426SR2FQ Stencil Template 90*90
FH82HM370 SR40B Stencil Template 90x90
Brands: Chipsetpro.com
€9.95
FH82HM370 SR40B Stencil Template 90*90
10pcs S3 S4 S5 S6 Note Samsung mobile phone motherboard maintenance Stencil Template
Brands: Chipsetpro.com
€18.65
10pcs S3 S4 S5 S6 Note Samsung mobile phone motherboard maintenance Stencil Template
i54210H SR1Q0 Stencil Template 90x90
Brands: Chipsetpro.com
€9.52
i5-4210H SR1Q0 Stencil Template 90*90
FH82QMS3 SR40F Stencil Template 90x90
Brands: Chipsetpro.com
€9.95
FH82QMS3 SR40F Stencil Template 90*90
FW82801DBM Stencil Template
