Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
No customer reviews for the moment.
EMMC/EMCP/UFS/Font BGA153/162/169/186/221/254 Stencil Solder Station Kits
10in1 BAG96 BGA100 BGA132 BGA136 BGA152 BGA272 BGA316 2246XT 2258XT AS2258-BN Stencil Template
GTX970M N16E-GT-A1 Stencil Template 90*90
i3-3217U SR0N9 Stencil Template 90*90
BD82C606 SLJKH Stencil Template 90*90
PS4 CXD90044GB Stencil Template 90*90
