Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
CH004985
No customer reviews for the moment.
16 other products in the same category
25Q64 LM36272 36273 36274 BGA24 Stencil Template
Brands: Chipsetpro.com
€16.16
25Q64 LM36272 36273 36274 BGA24 Stencil Template
10pcs S3 S4 S5 S6 Note Samsung mobile phone motherboard maintenance Stencil Template
Brands: Chipsetpro.com
€18.65
10pcs S3 S4 S5 S6 Note Samsung mobile phone motherboard maintenance Stencil Template
GF-GO7600-N-B1 Stencil Template
