Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
No customer reviews for the moment.
SR17E SR17C SR17D SR13J SR13H DH82HM86 DH82HM87 Stencil Template
TU102-300A-K5-A1 TU102-400-A1 TU102-875-A1 TU102-300A-K1-A1 Stencil Template
i7-4500U SR16Z Stencil Template 90*90
N16E-GS-KAB-A1 Stencil Template 90*90
i3-2310M SR04S Stencil Template 90*90
N17P-G0-B-KC-A1 Stencil Template
