![](https://www.chipsetpro.com/1042-large_default/2160728016-stencil-template.jpg)
![](https://www.chipsetpro.com/1042-large_default/2160728016-stencil-template.jpg)
Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
No customer reviews for the moment.
SR0FB Pentium Dual-Core Mobile Stencil Template 90*90
AM5000IBJ44HM AM5200IAJ44HM AMD Stencil Template
SRCKB SRCUU SRD1V SREJP SREJQ SREJR SRF6X SRFFX SRFFZ SRGKW 8265U 8565U Stencil Template