Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
No customer reviews for the moment.
16 other products in the same category
SR177 SR1JJ SR173 SR175 SR176 SR178 SR179 Stencil Template
SR177 SR1JJ SR173 SR175 SR176 SR178 SR179 Stencil Template
i74750HQ SR18J Stencil Template 90x90
i7-4750HQ SR18J Stencil Template 90*90
12in1 BGA199 BGA130 BGA149 BGA67 BGA202 BGA182 BGA137 BGA63 BGA127 BGA134 BGA95 BGA107 Stencil Template
12in1 BGA199 BGA130 BGA149 BGA67 BGA202 BGA182 BGA137 BGA63 BGA127 BGA134 BGA95 BGA107 Stencil Template
i36167U SR2JF Stencil Template 90x90
i3-6167U SR2JF Stencil Template 90*90