Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
CH000863
No customer reviews for the moment.
16 other products in the same category
GL82HM170 SR2C4 Stencil Template 90x90
Brands: Chipsetpro.com
€17.14
GL82HM170 SR2C4 Stencil Template 90*90
11pcs iphone5 iphoneX Stencil Template
Brands: Chipsetpro.com
€19.89
11pcs iphone5 - iphoneX Stencil Template
Celeron DualCore SR08N Stencil Template 90x90
Brands: Chipsetpro.com
€9.96
Celeron Dual-Core SR08N Stencil Template 90*90
AM963PAEY44AB Stencil Template 90x90
Brands: Chipsetpro.com
€17.14
AM963PAEY44AB Stencil Template 90*90
BGA178 LPDDR3 H9CCNNNBJTAL H9CCNNNBLTAL FA232A1MA Stencil Template
Brands: Chipsetpro.com
€5.59
BGA178 LPDDR3 H9CCNNNBJTAL H9CCNNNBLTAL FA232A1MA Stencil Template
i76820HK SR2FL Stencil Template 90x90
Brands: Chipsetpro.com
€9.50
i7-6820HK SR2FL Stencil Template 90*90
GF-GO7600-N-A2 Stencil Template
