i56287U SR2JJ Stencil Template 90x90
i5-6287U SR2JJ Stencil Template 90*90
Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
No customer reviews for the moment.
i5-6287U SR2JJ Stencil Template 90*90
i5-7300HQ SR32S Stencil Template 90*90
i5-4300U SR1ED Stencil Template 90*90
FM880PAAY43KA Stencil Template 90*90
i7-2637M SR0D3 Stencil Template 90*90
GL82H110 SR2CA Stencil Template 90*90
i5-7200U SR2ZU Stencil Template 90*90