
CM141 LeadFree Titanium Alloy Solder Soldering Pot Desoldering Bath 900W 110V
CM141 Lead-Free Titanium Alloy Solder Soldering Pot Desoldering Bath 900W 110V
Foxconn H4 Socket LGA1151 CPU Base 1151 PC Connector BGA Base
Part Number LGA1151 Socket Manufacturer Foxconn
BGA Alloy No Pb/Lead Free Socket type BGA1150
Package/Case 1 PCS Description Brand New
Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
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CM141 Lead-Free Titanium Alloy Solder Soldering Pot Desoldering Bath 900W 110V
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