TOSHIBA C650 C660 C655 C655D L650 L650D L655 L670 L675 L750 L755 US Keyboard
TOSHIBA C650 C660 C655 C655D L650 L650D L655 L670 L675 L750 L755 US Keyboard
Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
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TOSHIBA C650 C660 C655 C655D L650 L650D L655 L670 L675 L750 L755 US Keyboard
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