Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
No customer reviews for the moment.
900M-T-SK KINGBOX 936 lead-free soldering iron head thermostatic head
10pcs/set soldering iron head 900M thermostatic head for Hakko KINGBOX 933 376 936 soldering rework station
12pcs/set 900M-T KINGBOX 936 lead-free soldering iron head thermostatic head
Aluminium Foil Tape 50mm*40m Roll Ideal For Heat Reflection
USB2.0 high speed card reader MS.CF.TF.SD 6in1 card reader
20mm*30m Single Conductive COPPER FOIL TAPE Electronic Tool
QUICK 861DW lead-Free hot 1000W 220V High-Power Hot air Disassembly Station
900M-T-K KINGBOX 936 lead-free soldering iron head thermostatic head
20mm*33m Kapton Tape High Temperature Heat Resistant Polyimide
0.3m OMEGA K-TYPE Thermocouple TT-K-30-SLE
2 megapixel camera VGA High-Definition High-Speed Microscopic Camera Industrial Camera Mobile Phone
M402SD07G VFD MODULE M402SD07GK M402SD07GS M402SD07J M402SD07GM M402SD07GR
6# SATA Hard Disk Power Line Transfer Line 4 pin IDE to SATA serial Connection Line
USB 3.0 To SATA 22 Pin 2.5 3.5 Inch Hard Disk Driver SSD Adapter Cable Converter
WOWSTICK Multifunctional manual screw driver set Household screw driver Mobile phone and computer maintenance tool
Foxconn Socket LGA2011-V3 CPU Base PC Connector BGA Base
