Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
No customer reviews for the moment.
USB CP2102 to TTL RS232 USB TTL to RS485 Mutual Convert 6in1 Convert Module
T13-B BaKon integrated heating core lead-free portable 75W constant temperature soldering iron core
FPC Socket Connector For ASUS X555 A555 K555 VM590 Y583 R556 X554 F555 HDD Board 50pin
LVDS Cable for screen Toshiba L500 LED p/n: 6017B0198301 V000180110
HW-632 XH-M603 Board Charge Control Module 12-24V Storage Lithium Battery Protection
LVDS Cable for screen Lenovo G470 G475 P/N: DC020015T10 PIWG
LVDS Cable for screen HP 15-p p/n: DDY14ALC000 DDY14ALC010 DDY14ALC020 DDY14ALC130 DDY14ALC140 DDY14ALC14
Weller LT1L TIP Round 0.2 MM WSP80 Sillver Series
Socket LGA1156 CPU Base 1156 PC Connector BGA Base
LVDS Cable for screen Asus B34Y p/n: 1422-017S000 1422-01AE000
BST-M001 Mobile Phone Circuit Board Maintenance Fixture
Battery for Acer EC39c EC49c (10.8V 5200mAh) AS10H31 AS10H3E AS10H51 AS10H75 AS10H7E
25ml Multi-functional Adhesive Glue B-7000 For Mobile Phone Universal
Laird T-FLEX700/740 GPU CPU Graphics Card Heat Dissipation Efficient Pad
Foxconn Socket LGA2011-V3 CPU Base PC Connector BGA Base
