Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
No customer reviews for the moment.
0.3 15mm*15mm Heatsink Thermal Pad Copper Shim for Laptop CPU GPU Copper Plate
T13-BL BaKon integrated heating core lead-free portable 75W constant temperature soldering iron core
DH-380 Welding platform drawer type touch screen BGA rework station
LVDS Cable for screen Toshiba L650 L655 p/n: A000075860 DD0BL6LC030 DD0BL6LC010
T13-C4 BaKon integrated heating core lead-free portable 75W constant temperature soldering iron core
LVDS Cable for screen Dell N5040 N5050 M5040 V1550 P/N: 50.4IP02.001 50.4IP02.302 50.4IP02.002
LED light Hand-hold Magnifier 40X 21mm MG6B-1B
M402SD07G VFD MODULE M402SD07GK M402SD07GS M402SD07J M402SD07GM M402SD07GR
LM2596 Adjustable DC-DC Buck Converter Step Down Voltage Regulator
Foxconn Socket G34 LGA1944 CPU Base BGA Connector Holder for AMD Server Desktop Opteron Processor
GORDAK 863 Full BGA Rework Solder Hot Air Heat Gun iron IR Infrared Preheating Station
2.0mm Blue GPU CPU Heatsink Silicone Compound Thermal Conductive Pad
Aluminium Foil Tape 30mm*40m Roll Ideal For Heat Reflection
3.5X-90X Simul-Focal Stereo Lockable Zoom Microscope on Dual Arm B 21MP Microscope 144LED
PGA 544H LGA775 Intel Motherboard Socket
