Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
No customer reviews for the moment.
LVDS Cable for screen HP 15-f 15-n p/n: DD0U86LC000 DD0U86LC010 DD0U86LC020 DD0U86LC030 732004
CM141 Lead-Free Titanium Alloy Solder Soldering Pot Desoldering Bath 900W 220V
0.3 15mm*15mm Heatsink Thermal Pad Copper Shim for Laptop CPU GPU Copper Plate
LVDS Cable for screen HP G6-2000 P/N: DD0R36LC000 DD0R36LC020 DD0R36LC030 DD0R36LC040 681817-0
LVDS Cable for screen Asus X551CA D550C F551M p/n: 14005-01070000 14005-01070100 14005-01070200
LVDS Cable for screen Lenovo G460 G465 Z460 Z465 P/N: DC02000ZM10 1BB9PL050E6 NIWE1
25K Qwin 0.40mm BGA Leaded Solder Balls
HAYEAR 2K 21MP 1080P 60FPS HDMI USB Industrial Digital Video Microscope Camera
DC Power Supply DPS-305BM Digital Control DC Voltage Regulated 30V 5A HONGSHENG 220V
1.5 15mm*15mm Heatsink Thermal Pad Copper Shim for Laptop CPU GPU Copper Plate
Desoldering Goot Wick CP-30B Japan Original RoHS
Battery For HP ProBook 4320T 4320s 4321s 4325s 4326s 4420s 4421s 4425s 4520s
LVDS Cable for screen HP 15-a 250 G4 255 G4 (40 pin) p/n: DC020027J00
QIANLI-008 Chip Repair Tool Set CPU Scraper Removal Chip
FPC FFC flat cable connector socket 32pin 1.0mm Pitch for Laptop keyboard interface
PGA 544H LGA775 Intel Motherboard Socket
