Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
No customer reviews for the moment.
LVDS Cable for screen Lenovo S300 S400 S500 p/n: DC02001KO10 DC02001SE10
5in1 Repair Opening Tools Metal Pry Spudger Disassemble Set for Phone Tablet
LVDS Cable for screen Asus X550 A550 R510 p/n: 1422-01FV000 1422-01FY000 1422-01M6000 1422-0108
Cooler Fan for Asus G71 G72 F70 F90 N70 M70 N90 X71 X73 X90
LVDS Cable for screen Samsung NC10 ND10 P/N: BA39-00766A BA39-00784A
1.0m S-993A S-995A Pump Solder Sucker Gun Suction nozzle
900M-T-K KINGBOX 936 lead-free soldering iron head thermostatic head
250K PMTC 0.35mm Sn96.5/Ag3/Cu0.5 BGA No Pb/Lead Free Solder Balls
7# SATA Hard Disk Power Line Transfer Line 4 pin IDE to SATA serial Connection Line
LVDS Cable for screen HP DV7-6000 p/n: 50.4RN10.012
LVDS Cable for screen Asus K52 LCD p/n: 1422-00rl000
LVDS Cable for screen Toshiba A300 p/n: DD0BL5LC000 DD0BL5LC100 DD0BL5LC300 GLEDD0BL5LC000
0.8mm Solder Wire Sn63/Pb37 MECHANIC HX-T100 The Finest Quality 200g
