CP3015 Goot Wick Desoldering

€2.70
Tax excluded

CP-3015 Goot Wick Desoldering

Chipsetpro.com

Chipsetpro.com

Quantity
Delivery will take 14-28 days

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004827

No customer reviews for the moment.

Write your review

CP3015 Goot Wick Desoldering

CP-3015 Goot Wick Desoldering

Write your review

16 other products in the same category