Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
CH001357
No customer reviews for the moment.
16 other products in the same category
SMD inductor package 47 Models L0805 Sunlord inductors the sample books
Brands: Chipsetpro.com
€57.03
SMD inductor package 47 Models L0805 Sunlord inductors the sample books
SSM6N15FEAPEMOSFET FDC638APZ SOT563
Brands: Chipsetpro.com
€3.45
SSM6N15FEAPE=MOSFET FDC638APZ SOT563
26 Models 1300pcs Diode SMD Common 05W 24V30V package samples Kit
Brands: Chipsetpro.com
€42.73
26 Models 1300pcs Diode SMD Common 0.5W 2.4V-30V package samples Kit
CONEXANT CX20584-11Z
