Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
No customer reviews for the moment.
16 other products in the same category
26 Models 650pcs Diode SMD Common 05W 24V30V package samples Kit
26 Models 650pcs Diode SMD Common 0.5W 2.4V-30V package samples Kit
170 Models 8500pcs RC0201 SMD FR07 Series YAGEO Resistor 1 Accuracy Sample Book Assortment Kit
170 Models 8500pcs RC0201 SMD FR-07 Series YAGEO Resistor 1% Accuracy Sample Book Assortment Kit
BQ24192 for Glory 8 P7 Meizu XiaoMi Note3 charge IC 24pin CPM10A 2ME 300
BQ24192 for Glory 8 P7 Meizu XiaoMi Note3 charge IC 24pin CPM1.0A 2ME 300