Original BGA FH82HM470 HM470 SRJAU QS64 10th Gen South Bridge Chip
BGA FH82HM470 HM470 SRJAU QS64
Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
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BGA FH82HM470 HM470 SRJAU QS64
26 Models 1300pcs Diode SMD Common 0.5W 2.4V-30V package samples Kit